An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

The present invention is in the field of an improved method of applying a two-component adhesive, wherein the adhesive is provided packaged in a foil, typically one and the same foil, a package comprising said adhesive and an adapted sealing gun, said adapted sealing gun, and specific uses of said package and sealing gun.

A block copolymer consists mainly of structural units each derived from an ethylenically unsaturated monomer and has at least one mercapto group. The block copolymer has an Mn of 5,000-500,000 and has a block structure, which is an A-B-A triblock structure or a star-shaped block structure of [A-B]qX. The q is an integer of 2-6. The polymer block (A) has a glass transition temperature of 20° C. or higher. The polymer block (B) of the triblock structure has a glass transition temperature lower than 20° C., and the [polymer block (B)]qX of the star-shaped block structure has a glass transition temperature lower than 20° C. The X is an initiator residue or/and a coupling-agent residue or is a derivative thereof.

An electrically conductive adhesive layer includes a plurality of particles dispersed between opposing first and second major surfaces of the electrically conductive adhesive layer. The first and second major surfaces are spaced apart a distance D. The particles are agglomerated so as to form a plurality of substantially continuous layers of particles generally extending along orthogonal first and second directions and arranged along a third direction. Each substantially continuous layer of particles has a length L along the first direction from a first to an opposing second edge of the electrically conductive adhesive layer and a width W along the second direction extending from the first to the second major surface. L/D ≥ 100. At least some of the particles are electrically conductive.

Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

To provide an adhesive tape that is difficult to deform, can suppress stickiness on the sides, and can reduce the emission of greenhouse gases while meeting the required characteristics of adhesive tape, such as adhesive strength and holding force, the present invention use an adhesive tape including a base material, which is a laminate with a backside layer formed on one side of a base fabric by lamination processing; and an adhesive layer disposed on the opposite side of the base material from the backside layer, wherein the backside layer includes a thermoplastic resin including polyolefin and the adhesive layer includes natural rubber, a wood-based filler, a plant-derived plasticizer and a tackifier.

An adhesive sheet set including a pair of adhesive sheets respectively including an adhesive layer capable of being cured and adhered by being in contact with each other, and a method for producing a product using the same. An adhesive sheet set including a first adhesive sheet and a second adhesive sheet, wherein the first adhesive sheet includes a first separator and a first adhesive layer provided on one surface of the first separator, the second adhesive sheet includes a second separator and a second adhesive layer provided on one surface of the second separator, and the first adhesive sheet and the second adhesive sheet are configured to be cured and adhered by the first adhesive layer and the second adhesive layer being in contact with each other.

The present application relates to a cross-linkable composition. The present application can provide a cross-linkable composition without degradation of cross-linking efficiency while exhibiting conductivity by containing an ionic compound, and its use.

Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.