An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

The purpose of the present invention is to improve surface scratch problems occurring in the manufacturing process and handling of an adherend on which stamping foil is applied, prevent a problem in which a transfer layer of stamping foil is separated at a portion that is bent when the adherend is folded, secure binding force in printing with various inks, and fundamentally prevent powder generated during cutting according to a product standard in a stamping foil manufacturing process. To this end, the stamping foil of the present invention comprises: (a) a base film which is removed after stamping transfer; (b-1) a wear-resistant release layer formed on the base film and containing a polyurethane-based release agent, an acrylic resin, and an ethene-based polymer additive, or (b-2) (i) a polyurethane-based release layer formed on the base film and (ii) a wear-resistant layer formed on the polyurethane-based release layer and containing an acrylic matrix resin and an ethene-based polymer additive; (c) a moisture penetration-preventing and metal-deposited heat-resistant cured coating layer; (d) a metal deposition layer formed on the moisture penetration-preventing cured coating layer; and (e) optionally, a thick film protective layer formed on the metal deposition layer, for preventing the corrosion of the metal deposition layer.

A water-dispersed pressure-sensitive adhesive composition of the present invention includes a water-dispersible polymer, a carboxylic acid copolymer thickener, a polyacrylic acid thickener, and water. A ratio of the carboxylic acid copolymer thickener in the solid content of the water-dispersed pressure-sensitive adhesive composition is 0.1% by mass or more and 1.5% by mass or less. A ratio of the polyacrylic acid thickener in the solid content of the adhesive composition is 1% by mass or more and 3.7% by mass or less. A pressure-sensitive adhesive sheet of the present invention has a pressure-sensitive adhesive layer formed from the water-dispersed pressure-sensitive adhesive composition.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

The invention provides a composition for forming an easy-to-detach thin resin film, the composition being characterized by including a urethane (meth)acrylate compound, and a first polymerizable composition containing an ethylenic unsaturated monomer having a tert-butoxy group and a radical polymerization initiator, or a polymer of a second polymerizable composition containing the ethylenic unsaturated monomer having a tert-butoxy group, wherein the amount of the ethylenic unsaturated monomer having a tert-butoxy group is 5 mass % or more and less than 95 mass % with respect to the sum of the amount of the urethane (meth)acrylate compound and the total amount of the monomer(s) contained in the first polymerizable composition or the second polymerizable composition.

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.

The present disclosure relates to adhesives useful in preventing drifting during lamination of light redirecting films applied to photovoltaic cells. The adhesives of the present disclosure have other useful applications in bonding and/or affixing other solar energy components.

An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.

A roof system comprising a roof substrate, a first membrane including first and second opposed planar surfaces, and a second membrane including opposed first and second planar surfaces, where said second membrane is adhered to said roof substrate through an adhesive disposed on said roof-substrate contacting portion of the first membrane, and where said second membrane is adhered to said first membrane through said adhesive disposed on a lap portion of said second membrane.

A sealing film which seals between a metal first base and a second base, the sealing film including: a first adhesive layer that mainly contains an acid-modified polyolefin and adheres to the first base; a second adhesive layer that mainly contains a polyolefin and adheres to the second base; and a base material layer provided between the first adhesive layer and the second adhesive layer, in which the base material layer contains (A), (B), and (C), a ratio [(A)/(B)+(C)] is 90/10 to 20/80, a content percentage of (B) with respect to a total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less, and a content percentage of (C) with respect to the total amount of (A), (B), and (C) is 5% by mass or more and 70% by mass or less.