Disclosed are an apparatus and a method for separating a semiconductor chip disposed on a base member via an adhesive member from the base member. The method includes: a step of providing a push member on a side of the base member opposite to a side on which the semiconductor chip is disposed and moving the push member in a direction adjacent to the semiconductor chip; and a step of separating the semiconductor chip, moved together with the push member, from the base member through a pick-up unit. The adhesive member and the push member are each magnetized such that repulsive forces act on each other.

The present invention relates to a heat separable two-layer adhesive system, to a process of adhesive debonding using the adhesive system and to a heat separable bonded composite body. In particular, the present invention relates to a heat separable two-layer adhesive system comprising an adhesive layer having conductive particles.

Provided is an adhesive film production apparatus for producing an adhesive film having an adhesive layer on a base material layer, the adhesive layer having an elastic modulus at 230° C. of 1 MPa or greater and having a glass transition temperature higher than normal temperature, the adhesive film production apparatus including a feeding roller; a cutting part; and a plurality of winding cores, wherein the raw film of the adhesive film is wound on the feeding roller such that the adhesive layer faces outward, and wherein in the conveyance path of the adhesive film traveling from the cutting part toward the winding core, the number of times of the adhesive layer of the adhesive film bending in a convex manner is set to be equal to or more than the number of times of the adhesive layer bending in a concave manner.

Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.

A crosslinked adhesive composition comprising: (i) a polymer; (ii) solid particles embedded within the polymer; and (iii) a multiplicity of boronate linkages crosslinking between the polymer and solid particles, wherein the boronate linkages have the formula

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wherein the polymer and particles are connected to each other through the boronate linkages, and the crosslinked adhesive composition has an ability to bond surfaces and a further ability to thermally debond and rebond the surfaces. Also described herein is a method of bonding first and second surfaces together, the method comprising placing the above-described crosslinked adhesive composition onto the first surface and pressing the second surface onto the crosslinked adhesive composition on the first surface.

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.

The present teachings contemplate a method comprising coating a poly(vinyl chloride) material with a composition including a dicarbonyl compound, a cyanoacrylate compound, or a combination thereof and a viscosity modifying agent so that the composition has a viscosity of from about 50 cps to about 2500 cps; wherein the coated poly(vinyl chloride) material is capable of adhering to a second material without the use of a primer.

A method of making an adhesive for an ice protection assembly includes mixing ferrous nanoparticles into the adhesive. Removal of the adhesive for ice protection assembly inspection or repair includes heating the ferrous nanoparticles in the adhesive to soften the adhesive and allow for easy removal or repositioning of the ice protection assembly.

Articles comprising pressure-sensitive adhesives and methods of their use for removing micro- and nanoplastic particles from various media, including wastewater effluent, laundry effluent, and indoor air, are disclosed.

An adhesive set is disclosed. This adhesive set includes a main agent containing a compound having two or more isocyanate groups and a curing agent containing a compound having two or more hydroxyl groups. At least one of the compound having two or more isocyanate groups and the compound having two or more hydroxyl groups has a disulfide bond in the molecule. At least one of the main agent and the curing agent further contains a curing catalyst. At least one of the main agent and the curing agent further contains a photoradical generator.