Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.

A method of directly joining a polymer to a metal along a joint interface through the formation of C—O—M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; and applying force to the joint interface of the metal and the polymer to generate intimate atomic contact between the metal and the polymer to create C—O—M chemical bonds between the metal and the polymer.

A digitally printed heat transfer label and method of manufacture is disclosed. The heat transfer label and method of manufacture provides a more efficient process with less waste, as well as prevents halos. The method comprises adding adhesive powder to a digital image printed on a substrate to produce a high stretch, multi-color photographic quality label for the apparel industry.

A method of directly joining a polymer to a metal along a joint interface through the formation of C—O-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; physically contacting at least one of the metal and the polymer; and applying compression pressure to the joint interface of the metal and the polymer when the metal is above the glass transition temperature of the polymer and less than the flash ignition temperature of the polymer and less than the metal melting temperature of the metal to generate intimate atomic contact between the metal and the polymer to create C—O-M chemical bonds between the metal and the polymer.

A method of directly joining a polymer to a metal along a joint interface through the formation of CO-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; physically contacting at least one of the metal and the polymer; and applying compression pressure to the joint interface of the metal and the polymer when the metal is above the glass transition temperature of the polymer and less than the flash ignition temperature of the polymer and less than the metal melting temperature of the metal to generate intimate atomic contact between the metal and the polymer to create CO-M chemical bonds between the metal and the polymer.

Adhesive tapes and methods comprise an adhesive composition and a release material. One adhesive tape may have a release material comprising a peel tab region and an adhesive composition region, the adhesive composition region may bear the applied adhesive composition, the adhesive tape may extend along a lengthwise direction of the adhesive tape, and the peel tab region may extend perpendicularly to the lengthwise direction of the adhesive tape. The one adhesive tape may be configured in such a way that the extent of the peel tab region along the lengthwise direction varies.

An adhesive film can include a barrier layer and an adhesive layer. In an embodiment, the barrier layer can have a melting temperature of at least 230 C. and the adhesive layer having a melting temperature of no greater than 200 C. In an embodiment, an article can include the adhesive film bonded to a substrate.

A method of directly joining a polymer to a metal along a joint interface through the formation of CO-M chemical bonds, where M represents an element in the metal to be joined. The method includes heating the metal to a predetermined temperature above a glass transition temperature of the polymer and less than a flash ignition temperature of the polymer and less than a metal melting temperature of the metal; and applying force to the joint interface of the metal and the polymer to generate intimate atomic contact between the metal and the polymer to create CO-M chemical bonds between the metal and the polymer.

Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.