A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125° C. The base material layer has a first layer which contains a polyolefin having a melting point of 150° C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145° C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25° C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

The present invention aims to provide a packaging material having excellent printed image quality as well as excellent laminate strength and heat sealability. Provided is a packaging material including at least: a base film, a primer layer, a printed layer, an adhesive layer, and a sealant film in a stated order, the primer layer being formed of a primer composition containing a water-soluble polyvalent metal salt, a chlorinated polyolefin emulsion, and at least one selected from the group consisting of an acrylic emulsion, a vinyl acetate emulsion, and a urethane-modified polyester resin, the printed layer being formed of a printing ink containing a polyester polyurethane resin, the adhesive layer being formed of an aliphatic ester adhesive.

The present invention aims to provide a packaging material having excellent printed image quality as well as excellent laminate strength and heat sealability. Provided is a packaging material including at least: a base film, a primer layer, a printed layer, an adhesive layer, and a sealant film in a stated order, the primer layer being formed of a primer composition containing a water-soluble polyvalent metal salt, a chlorinated polyolefin emulsion, and at least one selected from the group consisting of an acrylic emulsion, a vinyl acetate emulsion, and a urethane-modified polyester resin, the printed layer being formed of a printing ink containing a polyester polyurethane resin, the adhesive layer being formed of an aliphatic ester adhesive.

A pressure-sensitive adhesive tape comprises a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125 C. The base material layer has a first layer which contains a polyolefin having a melting point of 150 C. or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145 C. for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25 C., and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.

A multi-layer plastic film as a carrier film for a glue layer, comprising a layer sequence of (a) an outer layer (a) based on a mixture of ) 3-15 wt % of an extrudable glue and ) 85-97 wt % of at least one C.sub.2-C.sub.8 olefin-alkyl acrylate copolymer, C.sub.2-C.sub.8 olefin-methacrylic acid copolymer and/or C.sub.2-C.sub.8 alkyl methacrylate copolymer, wherein the mixture of ) and ) must be compatible with each other, (b) a layer (b) of at least one polyolefin or one olefin copolymer, (c) a layer (c) of at least one polyolefin or one olefin copolymer, and optionally typical auxiliary substances, as a second outer layer, and composites of said carrier film and an adhesive layer.

A water-activated tape including: a laminate that includes a paper layer and a polymeric reinforcement film layer bonded to the paper layer; a primer coating disposed on the polymeric reinforcement film layer of the laminate; and a water-activatable adhesive layer disposed on the primer-coated surface of the polymeric reinforcement film.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively prevent moisture or oxygen added to an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.