Patent classifications
C09J2423/168
PRIMER FOR ADHESIVE TAPES
Primer for adhesive tape with improved adhesion promoting properties, comprising a mixture G, which is dissolved or dispersed in one or more solvents, consisting of at least one copolymer obtained by copolymerization of a monomer mixture comprising an amount of at least 90 wt % of the following monomers: vinylcaprolactam and/or vinylpyrrolidone; one or more of the monomers a) and/or b): a) acrylic acid ester of a linear, primary alcohol having 2 to 10 carbon atoms in the alkyl group of the alcohol, b) acrylic acid ester of a branched, non-cyclic alcohol having 3 to 12 carbon atoms in the alkyl group, at least one chlorinated polyolefin, and at least one metal compound selected from the group consisting of metal acetylacetonates, metal alkoxides and alkoxy-metal acetylacetonates.
A THERMOPLASTIC COMPOSITION HAVING IMPROVED MECHANICAL PROPERTIES
A thermoplastic composition including a thermoplastic polymer component and at least one elastomer, wherein the thermoplastic polymer component comprises at least one propylene copolymer having a propylene content of at least 60 wt.-% and at least one ethylene copolymer having an ethylene content of at least 50 wt.-%. The invention is also directed to a sealing device comprising a waterproofing layer obtained by using the thermoplastic composition, to a method for producing a sealing device, to a method for waterproofing a substrate, and to a method for bonding a first substrate to a second substrate.
METHOD FOR ADHERING PROFILES TO SUBSTRATE SURFACES
Provided are methods for adhesively bonding profiles to substrate surface. An example method includes plasma-treating each of a profile surface and a first adhesive side of a layer of pressure sensitive adhesive. The pressure sensitive adhesive includes a) 40 to 70 wt %, based on the total weight of the pressure sensitive adhesive, of at least one poly(meth)acrylate; b) 15 to 50 wt %, based on the total weight of the pressure sensitive adhesive, of at least one synthetic rubber; and c) at least one tackifier compatible with the poly(meth)acrylate(s). The method further includes bonding the profile surface and the first adhesive side to one another, plasma-treating a second adhesive side of the layer of the pressure sensitive adhesive, and bonding the plasma-treated second adhesive side to the substrate surface.
Primer for adhesive tapes
Primer for adhesive tape with improved adhesion promoting properties, comprising a mixture G, which is dissolved or dispersed in one or more solvents, consisting of at least one copolymer obtained by copolymerization of a monomer mixture comprising an amount of at least 90 wt % of the following monomers: vinylcaprolactam and/or vinylpyrrolidone; one or more of the monomers a) and/or b): a) acrylic acid ester of a linear, primary alcohol having 2 to 10 carbon atoms in the alkyl group of the alcohol, b) acrylic acid ester of a branched, non-cyclic alcohol having 3 to 12 carbon atoms in the alkyl group, at least one chlorinated polyolefin, and at least one metal compound selected from the group consisting of metal acetylacetonates, metal alkoxides and alkoxy-metal acetylacetonates.
Pretreatment of substrates that have unsaturated units
A method for treating substrates, including applying a composition, which includes at least one latent alkyl borane and is substantially free of decomplexing agents for the latent alkyl borane, to a substrate (1) that has a material having unsaturated units, applying a radically curable substance to the substrate (1) pretreated with the latent alkyl borane, and allowing the radically curable substance to cure in order to form a composite structure. The method is suitable in particular for applying paints, coatings, or sealing materials/filling materials to substrates, such as EPDM, NBR, and SBR, and for adhesively bonding such substrates. Composite materials adhesively bonded accordingly are distinguished by especially firm adhesion of the adhesive to the substrate, wherein conventional adhesives can be used, which have optimized properties with regard to the storage stability, open time, and cure time thereof.
CONNECTING OF SEALING STRIPS
A method for connecting sealing strips, includes at least one latent alkyl borane and is substantially free of decomplexing agent for the latent alkyl borane, to a sealing-strip substrate (1), applying a radical-curing adhesive to the sealing-strip substrate (1) pre-treated with the latent alkyl borane, bringing the sealingstrip substrate (1) in contact with a sealing-strip substrate (2) in such a way that the radical-curing adhesive is arranged between the two substrates, and allowing the radical-curing adhesive to cure, a composite structure thus being fonned. The method for adhesively bonding sealing strips based on elastic and thennoplastic substrates, such as EPDM or SBR, but also for adhesively bonding PVC sealing strips. Sealing strips adhesively bonded accordingly are characterized by favorable resistance of the adhesive to alkaline media, wherein conventional adhesives can be used which have optimized properties with regard to the storage stability, the open time, and the curing time thereof.