C09J2433/001

ULTRA-QUIET BACKING-PAPER-FREE COLD LAMINATING FILM AND PREPARATION METHOD THEREOF
20220340782 · 2022-10-27 ·

The present invention discloses an ultra-quiet backing-paper-free cold laminating film comprising a substrate layer, a release layer, and an adhesive layer, the release layer and the adhesive layer being each attached to a respective side of the substrate layer, the release layer being obtained by drying a release agent applied on the substrate layer, and the release agent consisting of the following components by weight: 2-ethylhexyl acrylate, vinyltrimethoxysilane, 1-methyl-1-phenylethyl hydroperoxide, vinyl-terminated silicone resin, di-t-butyl cumene peroxide, fluorosiloxane, ethyl acetate, ethylene glycol dimethyl ether, a toughening agent, polysiloxane-polyether copolymer, silicone and wax powder. In the invention, the peel strength is reduced; it is ensured that the release force of the cold laminating film is not affected by the external environment, such that the cold laminating film has good stability; and meanwhile the subsequent adhesion of the release layer is improved, so that it can ensure that the adhesive force of the adhesive layer would not be affected after long-term adhesion between the adhesive layer and the release layer.

HOT MELT TAPE AND MANUFACTURING AND USING METHOD THEREOF
20220332981 · 2022-10-20 ·

The present disclosure provides a hot melt tape at least including a substrate, an adhesive layer, and an anti-sticking layer, wherein the anti-sticking layer is adjacent to the adhesive layer and is the outermost layer of the hot melt tape. The hot melt tape may be used to seal objects, and preferably is made of a multilayer co-extrusion process. The anti-sticking layer prevents the hot melt tape from sticking the objects without needing a release film, and the hot melt tape can be directly heated during sealing the objects.

PRESSURE-SENSITIVE ADHESIVE SHEET AND USE THEREOF
20230144464 · 2023-05-11 ·

Provided is a PSA sheet that can combine bonding reliability and peeling removability, and further can be peeled off without causing deformation or damage to the adherend in various peeling modes. The PSA sheet provided by this invention has a PSA layer. The PSA sheet has a water-peel strength of 2 N/10 mm or less. The PSA sheet further has a stress at 100 % elongation of less than 30 MPa as well as a multiplication product (σf-εf) of fracture stress σf (MPa) and fracture strain εf (%) of 250 or greater.

Adhesive tape for encapsulating electronic constructions
11242469 · 2022-02-08 · ·

The aim is to provide an adhesive tape that effectively protects an electronic construction from permeants, especially water, and that at the same time has good gap-filling qualities. To solve this problem an adhesive tape is proposed that has in the following order:—a carrier layer without barrier effect at least towards water and with a WVTR of at least 1 g/(m.sup.2*d) (38° C., 90% relative humidity, 50 μm layer thickness); —a layer comprising at least one getter material capable of sorbing at least water; —a water barrier ply; and—a layer of pressure-sensitive adhesive, where the carrier layer bears an outward-facing release layer and/or the layer of pressure-sensitive adhesive is lined with a release liner which has a release layer lying on the layer of pressure-sensitive adhesive.

Semiconductor Processing Adhesive Tape and Method of Manufacturing Semiconductor Device
20210265193 · 2021-08-26 · ·

A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.sup.3.

Semiconductor Processing Adhesive Tape and Method of Manufacturing Semiconductor Device
20210265193 · 2021-08-26 · ·

A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m.sup.3.

ADHESIVE TAPE

An adhesive tape includes a substrate [I] and an adhesive agent layer of a polyester adhesive agent provided on at least one of opposite surfaces of the substrate [I]. The substrate [I] is one selected from a polyolefin resin foam substrate, a urethane resin foam substrate, and an acrylic resin foam substrate. The polyester adhesive agent is made from a polyester adhesive agent composition [II] which contains a polyester resin (A) having a weight average molecular weight of 5,000 to 300,000, and having a structural unit derived from a polyol and a structural unit derived from a polyvalent carboxylic acid compound containing an aromatic structure-containing compound in a proportion of not greater than 80 mol %. The adhesive tape is excellent in adherence between a polyester adhesive agent layer and a polyolefin resin foam substrate, a urethane resin foam substrate, or an acrylic resin foam substrate.

MULTILAYER FILM AND MOLDED BODY PROVIDED WITH SAME

A multilayer film and a decorative film, each of which is excellent in chipping resistance, exhibits favorable adhesive properties to a variety of resin materials, such as polypropylene and ABS, and a molded body provided with such a film. The multilayer film includes three layers of an impact absorption layer (a), a base material layer (b), and a pressure sensitive adhesive layer (c) disposed in this order, wherein a thermoplastic polymer composition constituting the impact absorption layer (a) is composed of at least one block copolymer containing a polymer block (X) containing a structural unit derived from an aromatic vinyl compound and a polymer block (Y) containing a structural unit derived from a conjugated diene compound, or a hydrogenated product thereof; and has a loss tangent (tan δ) at 11 Hz in a range of −50 to −20° C. of 3×10.sup.−2 or more.

Barrier elements on a microstructured article having adhesive sealing layer and specified modulus of elasticity

The disclosed light directing article comprises a structured layer, an adhesive sealing layer, and barrier elements. The structured layer comprises multiple microstructured elements that are opposite a major surface. The adhesive sealing layer has a first region and a second region. The second region is in contact with the structured layer. The barrier element are at the first region. The first region with the barrier element and second region have sufficiently different properties to form a low refractive index layer between the adhesive sealing layer and the structured layer. The barrier element comprises a crosslinked polymeric matrix having a modulus of elasticity less than 4.4 GPa.

Method for Producing an Adhesive Tape
20200339839 · 2020-10-29 ·

The invention relates to a method for producing an adhesive tape, by: providing a tapelike textile carrier (2),

applying a thickener (7) and separately aqueous dispersion-based adhesive (8) to the textile carrier (2), the thickener (7) and the aqueous dispersion-based adhesive (8) coming into contact with each other once applied, then drying the dispersion-based adhesive (8).