Provided is a recording medium for a nail sticker and a method of manufacturing the same, and more particularly, to a recording medium and a method of manufacturing the same, which show that an ink reception layer is formed on a base of a polyurethane material so that a nail sticker can be printed using a sublimation printer. The recording medium for a nail sticker comprises: a release paper; an adhesion layer formed on the release paper; a base of a polyurethane material attached onto the adhesion layer; an undercoating layer formed on the base; and an ink reception layer formed on the undercoating layer.

The purpose of the present invention is to improve surface scratch problems occurring in the manufacturing process and handling of an adherend on which stamping foil is applied, prevent a problem in which a transfer layer of stamping foil is separated at a portion that is bent when the adherend is folded, secure binding force in printing with various inks, and fundamentally prevent powder generated during cutting according to a product standard in a stamping foil manufacturing process. To this end, the stamping foil of the present invention comprises: (a) a base film which is removed after stamping transfer; (b-1) a wear-resistant release layer formed on the base film and containing a polyurethane-based release agent, an acrylic resin, and an ethene-based polymer additive, or (b-2) (i) a polyurethane-based release layer formed on the base film and (ii) a wear-resistant layer formed on the polyurethane-based release layer and containing an acrylic matrix resin and an ethene-based polymer additive; (c) a moisture penetration-preventing and metal-deposited heat-resistant cured coating layer; (d) a metal deposition layer formed on the moisture penetration-preventing cured coating layer; and (e) optionally, a thick film protective layer formed on the metal deposition layer, for preventing the corrosion of the metal deposition layer.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Provided are a multilayer film, a method for producing the multilayer film, and a method for producing a molded body. The multilayer film has excellent three-dimensional overlaying formability and adhesiveness after being formed; can easily be used when being bonded to an adherend; maintains adhesive strength. Specifically, the multilayer film has: an adhesive layer comprising a thermoplastic polymer composition containing a thermoplastic elastomer (A) which is a block copolymer or a hydrogenated product thereof having a polymer block (a1) containing aromatic vinyl compound units and having a polymer block (a2) containing conjugated diene compound units; and a base layer comprising an amorphous resin which has a modulus of elasticity of 2 to 600 MPa at an arbitrary temperature of 110 to 160° C. The tensile elongation at break of the multilayer film at a temperature 5° C. lower than the glass transition temperature of the amorphous resin is at least 160%.

A sealing for arrangement between a wall and a wall covering includes a sealing sheet and an adhesive tape. The sealing sheet and the adhesive tape each have a carrier layer of a preferably closed-cell foam plastic. Furthermore, the sealing sheet can bear a nonwoven fabric preferably on the wall-facing side, wherein border strips remain free of the nonwoven fabric for underlapping with an adhesive tape.

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.

A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.

An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.

Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.

Anti-icing stacks for protecting an aerodynamic surface are described. In some embodiments, an anti-icing stack includes an anti-icing layer, an elastomeric erosion protection layer, and an additional layer. The erosion protection layer is disposed between the anti-icing layer and the additional layer. The additional layer has a thickness greater than the thickness of the erosion protection layer and a tensile modulus of no more than the tensile modulus of the erosion protection layer. The additional layer may be a foam adhesive layer.