The present disclosure relates to an adhesive film, and adhesive film includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; an adhesive base film layer disposed on the photothermal conversion layer; a buffer layer disposed on the adhesive base film layer; and an adhesive layer disposed on the buffer layer, and the buffer layer includes a polysiloxane resin, and the adhesive layer includes a silicon-based adhesive, and the silicon-based adhesive includes a silicon-based tackifier and a polysiloxane resin. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

A surface protective sheet is used when grinding the rear surface of a semiconductor wafer having a circuit formed on the front surface, and is provided with: a base material comprising a support film and an antistatic coating layer which includes an inorganic conductive filler and a cured product of a curable resin (A); and an adhesive layer. The stress relaxation percentage of the base material after 1 minute at 10% elongation is at least 60%. The Young's modulus of the base material is 100-2000 MPa.

The present invention relates to a method for producing a single-sided adhesive film (1) for securing a load, comprising providing a backing layer (2) and coating a first side of the backing layer (2) with an adhesive layer (3), wherein a plastic (4) is applied to a second side of the backing layer (2) in order to form a non-slip surface on the adhesive film (1). Moreover, the present invention relates to a single-sided adhesive film (1) produced by the above method.

The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.

The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.

A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

The invention relates to a method for producing a single-sided adhesive film (1). Said method consists of providing a support layer (2) and coating a first side of the support layer (2) with an adhesive film (3), a lubricant coating (4) is applied to a second side of the support layer (2), the support layer (2) being in the form of a polyester film. Said method is characterised in that the polyester film, prior to bonding to the adhesive layer (3), and the lubricant coating (4) is treated with trichloroacetic acid, sodium persulphate, iron chloride or copper chloride in order to increase the surface energy of the polyester film. The invention also relates to a one-sided adhesive film (1) produced according to the above-mentioned method.

A display device in one example includes a display panel, a supporting frame supporting the display panel, and an adhesive between the display panel and the supporting frame. The supporting frame includes a case, and a thermal shape changing part constituting a portion of the case. The thermal shape changing part includes a shape memory material.

A multi-layer composition to be located onto a substrate. The composition comprises a bi-layer construction, including a first layer and a second layer, the first layer having a high elastic modulus and tensile strength in comparison to the second layer. The second layer includes a blowing agent such that, when cured, the first layer is spaced away from the substrate. The compositions of the first layer and second layer are similar, thus enabling the reconstitution of scrap into usable material for forming another multi-layer reinforcement.

This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.