An adhesive film is formed of an adhesive composition that includes a monomer mixture including a hydroxyl group-containing (meth)acrylate and a comonomer, and nanoparticles. The adhesive film has a glass transition temperature (Tg) of about −20° C. or less, an index of refraction of about 1.40 to about 1.55, and a haze of about 3% or less at a thickness of 100 μm.

Provided is a recording medium for a nail sticker and a method of manufacturing the same, and more particularly, to a recording medium and a method of manufacturing the same, which show that an ink reception layer is formed on a base of a polyurethane material so that a nail sticker can be printed using a sublimation printer. The recording medium for a nail sticker comprises: a release paper; an adhesion layer formed on the release paper; a base of a polyurethane material attached onto the adhesion layer; an undercoating layer formed on the base; and an ink reception layer formed on the undercoating layer.

The present application is drawn to infrared reflective ink formulations, infrared reflective dried coatings prepared from such inks, and IR-reflective substrates and adhesive tapes prepared from such inks and coatings. The inks are suitable for printing by gravure or flexo methods onto polymeric substrates such as PET, paper, or other substrate materials. The coatings are reflective in the near-infrared range. The coatings and tapes are well suited for use in manufacturing methods. The coatings and/or the tapes are ultrathin, on the order of a few micrometers, making them attractive for use in different industrial applications.

Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

The present disclosure provides an adhesive tape, a backlight module, a display device, and a method for manufacturing a backlight module. The adhesive tape includes: an adhesive body layer; an expandable structure layer on a side of the adhesive body layer and configured to fill a gap between the adhesive tape and a light guide plate of a backlight module through an expansion of the expandable structure layer.

Provided is a polarizing film laminate that is reworkable and excellent in bonding property over a long period of time. The polarizing film laminate includes: a polarizing plate including a polarizer; a first pressure-sensitive adhesive layer; a supporting substrate; and a second pressure-sensitive adhesive layer, which are laminated in the stated order, wherein the second pressure-sensitive adhesive layer surface of the polarizing film laminate has a pressure-sensitive adhesive strength to glass of 1.0 N/25 mm or more at a peel angle of 90° and a peel rate of 300 mm/min.

A PSA film includes a base material and a PSA layer on at least one side of the base material. The PSA layer has a temperature region, within the range of 70° C. to 100° C., in which its loss tangent tanδ is 0.8 or greater. The PSA film can be peeled off through irradiation with active energy radiation.

An object of the present invention is to provide a heat-resistant film that is suitable for protection of a surface provided with electrical conduction, decoration or the like in a plastic product, a glass product, a ceramic product, and the like, or that is suitable for holding a semiconductor, dies, and the like in producing dies through dicing and singulation. The film that solves the above object is a heat-resistant film comprising a thermoplastic resin, wherein (a) the thermoplastic resin is a polyester-based elastomer comprising a hard segment and a soft segment that are linked to each other, (b) the hard segment comprises a polyester unit constituted from an aromatic dicarboxylic acid and an aliphatic diol or an alicyclic diol, (c) the soft segment is constituted mainly from the prescribed polycarbonate, (d) a weight ratio of the hard segment contained in the polyester-based elastomer exceeds 50%, and (e) the film comprising the thermoplastic resin has an elastic modulus of 30 to 500 MPa, an elongation at break of 200 to 700%, and a ratio F50/F25 of 1.05 or more, the ratio F50/F25 being a ratio of a stress F50 at an elongation of 50% to a stress F25 at an elongation of 25%.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.