Release layers that include an oligomeric component comprising a unit of the Formula (I) are useful for releasably transferring components from one surface to another during manufacturing of microelectronic devices.

The disclosure relates to articles comprising a substrate, a pressure sensitive adhesive, and a release layer, wherein the release layer comprises at least one silicone carbonate polymer.

The disclosure relates to articles comprising a substrate, a pressure sensitive adhesive, and a release layer, wherein the release layer comprises at least one silicone carbonate polymer.

The disclosure relates to articles comprising a substrate, a pressure sensitive adhesive, and a release layer, wherein the release layer comprises at least one silicone carbonate polymer.