Barrier adhesive compositions include at least one polyisobutylene-containing polymer and a curable silsesquioxane additive. The curable silsesquioxane additive may contain free radically polymerizable groups. Barrier film articles include the barrier adhesive compositions and a film. The barrier film articles can be used to encapsulate organic electronic devices.

An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.

The present invention relates to an ethylene-vinyl alcohol copolymer composition, a single-layer film and a multilayer structure containing the same. Said ethylene-vinyl alcohol copolymer composition includes an ethylene-vinyl alcohol copolymer, an antioxidant, and a fluorine-containing compound; and the ratio of the antioxidant content to the fluorine content is 0.5 to 65. Thereby, the film containing said ethylene-vinyl alcohol copolymer composition not only has good heat resistance, but also can avoid the situation that a large number of gels are generated during the preparation process.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

A convenient sports tape, comprising a package body and a tape body; the package body has at least one transparent top sheet, a bottom sheet matching the top sheet with its edge connected to that of the top sheet, and a housing space formed between the top sheet and the bottom sheet, the housing space can store and clamp the tape body; the tape body is provided with at least one adhesion section, and a positioning section configured on one end of the adhesion section; the tape body has three layers in total, made up of a tape layer, an adhesive layer, and a releasing layer of the same shape; the tape layer can be configured according to the marbling of lean flesh.

The invention pertains to certain composite materials featuring strong direct bonds between certain fluoropolymers and polyamides, which can be formed by using as additive certain chlorotrifluoroethylene-containing elastomers, in an ionic curable blend.

The invention relates to a film comprising an optionally multilayer carrier layer; wherein one surface side of the carrier layer has been modified over part of its area either by surface activation or by printing with a print medium, such that the surface side has modified regions and unmodified regions; wherein the modified regions and the unmodified regions are coated over part or all of the area by a release material; and wherein the strength of adhesion of the release material to the carrier layer in the modified regions is different compared to the adhesion of the release material to the carrier layer in the unmodified regions.

A support tape extends longitudinally along an elongated object, is wrapped around the object, and has a pair of opposite longitudinal edges, an inner face engaging the object, and an outer face turned outward away from the object. The support tape is of single-layer design and having a class D abrasion resistance according to LV 312-1. One closure strip of an adhesive compound extends along one of the faces at one of the edges, and another closure strip of an adhesive compound extends parallel to the edges, along the other face, and transversely offset on the other face from the one closure strip. It is adhered to the one closure strip. A fixing strip of an adhesive compound extends longitudinally on the inner face, offset thereon from the one and other closure strips, and adheres the tape to the object.

The present invention is directed to a heat-activated adhesive patch with integral attachment device wherein said patch can be permanently attached to an article of clothing or other article made of natural or synthetic substrate by means of using heat and pressure, whereby said patch with integral attachment device can be used to attach or hang an article or device from said heat-activated patch using said integral attachment device.

The present disclosure provides adhesive mounting articles that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a hardgood that is flexible in a peel direction and rigid in a weight hanging direction. Such hardgoods may include a plurality of minimally connected body segments arranged about the transverse axis of the hardgood body.