An adhesive composition is described comprising unpolymerized cyclic olefin, a ring opening metathesis polymerization (ROMP) catalyst or precatalyst thereof, and one or more adhesion promoter polymers. In one embodiment, the adhesion promoter is a polyolefin comprising maleic anhydride or silicon-containing moieties. In one embodiment, a combination of at least one polymeric polyisocyanate and at least one polyolefin comprising maleic anhydride or silicon-containing moieties provides a synergistic improvement. In another embodiment, a polymeric polyisocyanate adhesion promoter comprising oxygen atoms in the backbone has been found useful for bonding substrates such as polyamide, polyether ether ketone, or polyether imide. Also described are methods of bonding a substrate and articles, such as an electric battery cold plate assembly.

Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

The present application relates to a retort food packaging film containing graphene and a method for manufacturing the retort food packaging film.

Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

The invention provides an adhesive composition. The adhesive composition includes a halohydrin compound, a blocked isocyanate compound and latex, in which the adhesive composition does not include resorcinol, formaldehyde and epoxy compound. The invention also provides a method for treating organic fiber. The method includes impregnating an organic fiber or a fabric with the abovementioned adhesive composition; and drying the organic fiber or the fabric.

The invention relates to a process for preparing a biaxially oriented multilayered film, the film comprising at least one layer comprising a polyolefin composition and at least one layer comprising a polyamide composition, the process comprising the steps of: a) Melting a polyamide composition comprising: i. a semi-crystalline polyamide Y comprising: monomeric units derived from caprolactam in an amount of at least 75 wt %; monomeric units derived from an aliphatic diamine in an amount of between 2.5 and 12.5 wt %; monomeric units derived from an aromatic diacid in an amount of between 2.5 and 12.5 wt %; wherein the weight percentage is given with respect to the total weight of the polyamide Y; ii. an amorphous polyamide in an amount of between 2.5 and 50 wt % with respect to the total weight of the polyamide composition; wherein the amorphous polyamide comprises: monomeric units derived from an aliphatic diamine X in an amount of between 30 and 70 wt %; monomeric units derived from an aromatic diacid in an amount of between 30 and 70 wt %; wherein the weight percentage is given with respect to the total weight of the amorphous polyamide; b) Melting a composition comprising a polyolefin; c) Co-extruding at least the melts obtained from a) and b) to form a film of at least two layers; d) Cooling the film to a temperature of at most 50 C., while the film is transported in a direction, referred to as machine direction; e) Stretching the film obtained in step d) with a stretch ratio of at least 13, at a temperature between the Tg of polyamide Y and Tm of the polyolefin, wherein the stretch ratio is defined as being the product of the stretch ratio parallel to the machine direction and the stretch ratio perpendicular to the machine direction. The invention also relates to a biaxially oriented multilayered film obtainable by the process.

The present invention relates to a method for welding two polyamide plastics using a primer, the primer containing at least one polymer synthesized from at least one maleic anhydride or maleic anhydride derivative. The invention also relates to correspondingly welded products.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.