Primer layers for adhesion of a pressure sensitive adhesive material to a substrate are provided. The primer layer comprises a crosslinked polymer. In some embodiments, the primer layer has an atomic nitrogen content of greater than 6 wt %, and in some a ratio of atomic weight percent of oxygen to nitrogen of less than 3.0. In some embodiments the crosslinked polymer is the reaction product of an amine-functional base polymer such as a polyethylenimine (PEI) and a crosslinker, which may be a polyaziridine crosslinker. Also provided are two-layer constructions comprising the primer layer and a substrate layer; and tapes, such as flexographic plate mounting tapes, comprising the two-layer construction and a pressure sensitive adhesive layer.

The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.