A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH/g or more.

A debonding tape includes a first tape layer including a first base layer having a first modulus and a first adhesive layer on the first base layer, wherein the first tape layer has a first diameter. The debonding tape includes a second tape layer on the first tape layer and supporting the first tape layer, wherein the second tape layer includes a second base layer on the first adhesive layer and having a second modulus greater than the first modulus, an intermediate layer on the second base layer, and a second adhesive layer on the intermediate layer. The second tape layer has a second diameter smaller than the first diameter such that a circumferential portion of the first tape layer is exposed in a cross-sectional view.

The present disclosure relates to an adhesive film, which includes: a photothermal conversion layer including a light absorbing agent and a pyrolytic resin; a first adhesive layer disposed on the photothermal conversion layer; a base film layer disposed on the first adhesive layer; and a second adhesive layer disposed on the base film layer, and the first adhesive layer and the second adhesive layer include a silicon-based adhesive. The adhesive film according to the present disclosure can simplify a process of processing a substrate, and can prevent a damage of the substrate and a circuit or an element formed on the substrate.

The present invention relates to a flexible film, more specifically, to a flexible film that not only exhibits high hardness, but also has excellent flexibility. According to the flexible film of the present invention, flexibility, bendability, high hardness, scratch resistance, and high transparency are exhibited, and there is no concern for damage of the film even when bended repeatedly or folded for a long time, and thus, it may be usefully applied for the front panels, display parts of bendable, flexible, rollable, or foldable mobile devices, display devices, various instrument panels, and the like.

The present disclosure discloses an optical clear adhesive and a display device. The display device includes: a flexible display panel having at least one foldable area; and an optical clear adhesive disposed on at least one side of the flexible display panel. The optical clear adhesive includes: a substrate layer, a first adhesive material structure and a second adhesive material structure disposed on two opposite sides of the substrate layer, all of which are transparent materials; a deformation recovery rate of the substrate layer is greater than that of each of the first adhesive material structure and the second adhesive material structure; and in the optical clear adhesive, the first adhesive material structure is closer to an inner folding side of the foldable area of a display panel, and the second adhesive material structure is closer to an outer folding side of the foldable area of the display panel.

Provided are a foldable back plate, a method of manufacturing the same and a foldable display device comprising the same.

Aerogels comprising a hydrophobic polyimide moiety, including hydrophobic polyimide aerogels, as well as methods of manufacture and applications thereof, are generally described.

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A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.

Provided are a foldable back plate film and a method of manufacturing the same.

Disclosed is a high-dielectric adhesive film, particularly a high-dielectric adhesive film including a substrate layer, a ceramic-mixed layer formed on one surface of the substrate layer and an adhesive layer formed on the surface of the substrate layer on which the ceramic-mixed layer is formed. The high-dielectric adhesive film thus configured is improved in permittivity due to the use of a ceramic component, thus preventing the malfunction of electronic devices, increasing the stability and performance thereof, and exhibiting heat dissipation effects.