Provided is a coating for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

An epoxy-curable silicone release coating composition and methods for its preparation and use are provided. The composition contains an inhibited Lewis acid catalyst. Releasing the Lewis acid catalyst from the inhibitor allows the Lewis acid to catalyze cure of the epoxy-groups. The composition can be coated on various substrates and cured to form a release liner.

The invention relates to a method for producing a release film by coating a carrier film using a release coating, wherein the method comprises the steps of: (a) providing the carrier film, wherein the carrier film has a first surface side and a second surface side; wherein the carrier film is preferably structured; (b) providing a coating composition which has a solvent component, preferably comprising ethyl acetate, propyl acetate, butyl acetate, and/or n-propanol, and a silicone system curable by UV radiation; (c) coating at least part of the first surface side of the carrier film provided in step (a) using the coating composition provided in step (b); (d) evaporating at least a part of the solvent component; and (e) irradiating at least part of the first surface side of the carrier film coated in step (c) using UV radiation to cure the silicone system.

Provided is a silicone composition having components (A) to (E):100 parts by mass of (A) a linear, branched, or network organopolysiloxane having a vinyl value of 0.01 mol/100 g or more and 0.04 mol/100 g or less and a viscosity of 100 mm.sup.2/sec or more and 500 mm.sup.2/sec or less at 25° C., wherein each of terminals of the organopolysiloxane has one or more alkenyl groups; 0.01 to 3 parts by mass of (B) a linear, branched, or network organopolysiloxane having a vinyl value of 0.2 mol/100 g or more and 1.2 mol/100 g or less and a viscosity of 2 mm.sup.2/sec or more and 60 mm.sup.2/sec or less at 25° C., wherein each of terminals of the organopolysiloxane has one or more alkenyl groups; (C) an organohydrogenpolysiloxane having an amount of 1 mol/100 g or more and 2 mol/100 g or less of an SiH group, wherein a ratio of the number of the SiH group in component (C) to a total number of the alkenyl groups in components (A) and (B) is 1 to 5; 0.01 to 10 parts by mass of (D) an addition-reaction control agent, relative to total 100 parts by mass of components (A), (B), and (C); and a catalytic amount of (E) a platinum group metal catalyst.

Provided is a silicone composition having components (A) to (E):100 parts by mass of (A) a linear, branched, or network organopolysiloxane having a vinyl value of 0.01 mol/100 g or more and 0.04 mol/100 g or less and a viscosity of 100 mm.sup.2/sec or more and 500 mm.sup.2/sec or less at 25° C., wherein each of terminals of the organopolysiloxane has one or more alkenyl groups; 0.01 to 3 parts by mass of (B) a linear, branched, or network organopolysiloxane having a vinyl value of 0.2 mol/100 g or more and 1.2 mol/100 g or less and a viscosity of 2 mm.sup.2/sec or more and 60 mm.sup.2/sec or less at 25° C., wherein each of terminals of the organopolysiloxane has one or more alkenyl groups; (C) an organohydrogenpolysiloxane having an amount of 1 mol/100 g or more and 2 mol/100 g or less of an SiH group, wherein a ratio of the number of the SiH group in component (C) to a total number of the alkenyl groups in components (A) and (B) is 1 to 5; 0.01 to 10 parts by mass of (D) an addition-reaction control agent, relative to total 100 parts by mass of components (A), (B), and (C); and a catalytic amount of (E) a platinum group metal catalyst.

Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a -conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

Film constructions and articles including the film constructions, wherein a film construction includes: a backing having a first major surface and a second major surface, wherein the backing includes at least one backing layer comprising a polylactic acid and an ethylene-containing copolymer comprising a polar comonomer; a tie layer disposed on the first major surface of the backing; and a release layer disposed on the tie layer.