This disclosure is directed to methods directly adhering epoxy-based, and other thermosetting surfacing films to solid thermoplastic surfaces and the structures derived or derivable from these methods. In some embodiments, the disclosure is also directed to composite structures comprising a thermoplastic substrate directly bonded to a thermoset(ting) surfacing film; wherein the direct bonding defines an interface between a thermoplastic surface of the thermoplastic substrate and a first surface of the thermoset(ting) surfacing film.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding,
the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2.

Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A resin-rubber composite in which a polyamide-based resin-molded product or a polyphenylene sulfide-based resin-molded product is directly vulcanization-bonded to a peroxide-crosslinkable nonpolar rubber composition, which forms a rubber layer, without interposing an adhesive, wherein both resin-molded products have a polymerized film with a radical, which is formed by activating the surface of the product, in the case of polyamide-based resin-molded products, by low-pressure plasma treatment by a microwave method using inert gas, or by activating the surface of the product, in the case of polyphenylene sulfide-based resin-molded products, by low-pressure plasma treatment by a microwave method using active gas, and then performing low-pressure plasma treatment by a microwave method using a hydrocarbon-based monomer in both cases. The resin-rubber composite can be effectively used for drum seals, automobile parts such as side cover seals for transmissions, anti-vibration rubber, resin rubber laminate hoses, and the like.