Patent classifications
C09J7/22
ADHESIVE LABEL
An adhesive label includes: a printable front side which is non-opaque to IR radiation; an adhesive layer for sticking the label to an application medium, the adhesive force of the front side being less than the gripping force of the adhesive layer; and a compound exhibiting a certain behaviour when illuminated by the IR radiation through the front side, the electromagnetic response of the compound during the illumination by the IR radiation being detectable through the front side.
INSPECTION DEVICE AND METHOD FOR INSPECTING AN ADHESIVE PATTERN ON A SUBSTRATE
Inspection devices and methods for inspecting an adhesive pattern on a substrate are disclosed. The inspection device includes at least one sensor having a heat sensor head for detecting a pattern of the adhesive bead, and a controller. Reference data representing a desired adhesive pattern is initially provided to a controller. A predetermined tolerance range for the desired adhesive pattern is also provided to the controller. An adhesive bead is discharged onto a substrate from a nozzle. A pattern of the discharged adhesive bead is then detected by the sensor when the substrate moves. Signals representing the detected pattern are received from the sensor at the controller. Finally, the signals representing the detected adhesive pattern are compared to the tolerance range of the desired adhesive pattern.
LABEL WITH ADHESIVE AND SILICONE-FREE RELEASE COATING
A label having a silicone-free (water-based) release coating and compatible adhesive patch is provided. The label includes a thermally coated substrate having a silicone-free substrate overlaid thereon of a first surface. A second surface includes a microsphere adhesive layer.
WAFER-FIXING TAPE, METHOD OF PROCESSING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR CHIP
A wafer-fixing tape, having: an temporary-adhesive layer provided on a substrate film, wherein the substrate film contains an ionomer resin comprising a terpolymer crosslinked by a metal ion, and wherein an arithmetic average roughness Ra of a surface of the substrate film opposite to the temporary-adhesive layer 5b is from 0.1 to 3.0 μm; a processing method of a semiconductor wafer; and a semiconductor chip.
Optical adhesive
An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.
Optical adhesive
An optical adhesive including a viscoelastic or elastomeric adhesive layer and a cured polymer layer immediately adjacent the viscoelastic or elastomeric adhesive layer is described. The viscoelastic or elastomeric adhesive layer a refractive index less than 1.570 and the cured polymer layer has a refractive index of at least 1.570. An interface between the viscoelastic or elastomeric adhesive layer and the cured polymer layer is structured. The cured polymer layer has a storage modulus of at least 2000 MPa at 20° C. and a glass transition temperature of no more than 65° C.
ADHESIVE FILM AND METHOD FOR MANUFACTURING THEREOF
The present disclosure relates to an adhesive film. Specifically, according to an embodiment of the present disclosure, there may be provided an adhesive film including: a guide film including a first area and a second area surrounding the first area; and an adhesive layer disposed on the first area, wherein the first area has a shape corresponding to a shape of the adhesive layer, wherein a cut-out portion disposed on a position adjacent to the adhesive layer is provided within a circumference of the second area.
Coating Tape for Inorganic Layer for Electrode and Method of Manufacturing the Same
The present invention relates to a coating tape and a method of manufacturing the same. More particularly, the present invention relates to a coating tape in which an inorganic layer formed on one surface or both surfaces of an electrode is formed in the form of an adhesive tape so as to be attached to a battery, and a method of manufacturing the same.
Coating Tape for Inorganic Layer for Electrode and Method of Manufacturing the Same
The present invention relates to a coating tape and a method of manufacturing the same. More particularly, the present invention relates to a coating tape in which an inorganic layer formed on one surface or both surfaces of an electrode is formed in the form of an adhesive tape so as to be attached to a battery, and a method of manufacturing the same.
Self-adhesive multi-layer item and method for the production thereof
A self-adhesive multi-layer item comprising: 1) a dorsal support DO having a top face SI1 and a bottom face SI2, 2) at least one layer of silicone release coating RC applied to the top face SI1 of the dorsal support DO and which is prepared by irradiation of a curable silicone composition C not containing any solvent and comprising, as constituents: a) at least one functionalized organopolysiloxane A b) an effective amount of at least one type I photoinitiator P of the family of acylphosphine oxide derivatives of formula (III) 3) at least one adhesive PSA, preferably at least one pressure-sensitive adhesive PSA, applied on the layer of silicone release coating, 4) a frontal support FR applied on the adhesive PSA of the component 3), and 5) optionally at least one layer of silicone release coating RC applied on the bottom face SI2 of the dorsal support DO and which is prepared by application and irradiation of said curable silicone composition C, and on this same layer, there is at least one adhesive PSA, preferably at least one pressure-sensitive adhesive PSA.