An adhesive formulation such as a hot melt adhesive or a pressure sensitive adhesive is provided comprising 5 to 98% (by weight) biodegradable substantially non-crystalline mcl-PHA. The mcl-PHA may be cured with a peroxide curing agent. The adhesive formulation may include an additional biodegradable polymer, or a non-biodegradable thermoplastic elastomer. Hot melt adhesives comprising significant amounts of biodegradable mcl-PHA, waxes, and tackifiers are also provided.

An adhesive formulation such as a hot melt adhesive or a pressure sensitive adhesive is provided comprising 5 to 98% (by weight) biodegradable substantially non-crystalline mcl-PHA. The mcl-PHA may be cured with a peroxide curing agent. The adhesive formulation may include an additional biodegradable polymer, or a non-biodegradable thermoplastic elastomer. Hot melt adhesives comprising significant amounts of biodegradable mcl-PHA, waxes, and tackifiers are also provided.

The invention relates to a hot-melt adhesive composition, comprising at least one polyolefin polymer at a content from 5 to 90% by weight; at least one branched polypropylene at a content from 0.1 to 10% by weight; at least one tackifying resin at a content from 0.1 to 60% by weight; optionally, at least one styrene block copolymer from 0 to 30% by weight; optionally, at least one plasticizer at a content from 0 to 30% by weight; optionally, at least one stabilizer at a content from 0 to 5% by weight; and optionally, at least one wax at a content from 0 to 30% by weight. The invention further relates to the use of a branched polypropylene for reducing stringing of a hot-melt adhesive composition.

The invention relates to a hot-melt adhesive composition, comprising at least one polyolefin polymer at a content from 5 to 90% by weight; at least one branched polypropylene at a content from 0.1 to 10% by weight; at least one tackifying resin at a content from 0.1 to 60% by weight; optionally, at least one styrene block copolymer from 0 to 30% by weight; optionally, at least one plasticizer at a content from 0 to 30% by weight; optionally, at least one stabilizer at a content from 0 to 5% by weight; and optionally, at least one wax at a content from 0 to 30% by weight. The invention further relates to the use of a branched polypropylene for reducing stringing of a hot-melt adhesive composition.

A hot melt adhesive composition that includes at least 40% by weight of a metallocene-catalyzed polybutene-1 selected from the group consisting of polybutene-1 homopolymer, polybutene-1 copolymer, and combinations thereof, the metallocene-catalyzed polybutene-1 including at least 30% by weight, based on the weight of the hot melt adhesive composition, of a metallocene-catalyzed polybutene-1 having a melt flow rate of at least 1000 grams per 10 minutes at 190° C., tackifying agent, and at least 15% by weight wax, the hot melt adhesive composition having a specific gravity of less than 0.95.

A hot melt adhesive composition that includes at least 40% by weight of a metallocene-catalyzed polybutene-1 selected from the group consisting of polybutene-1 homopolymer, polybutene-1 copolymer, and combinations thereof, the metallocene-catalyzed polybutene-1 including at least 30% by weight, based on the weight of the hot melt adhesive composition, of a metallocene-catalyzed polybutene-1 having a melt flow rate of at least 1000 grams per 10 minutes at 190° C., tackifying agent, and at least 15% by weight wax, the hot melt adhesive composition having a specific gravity of less than 0.95.

A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member.

A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a joint member including an adhesive layer, a heat generation layer, and a joint layer; and an adherend to which the wiring member is fixed, wherein the heat generation layer is a layer which can generate heat by induction heating and is provided between the adhesive layer and the joint layer, the joint layer is a layer having bond properties when heat is transmitted from the heat generation layer at a time of induction heating, the adhesive layer is fixed to one of the wiring member and the adherend, and the joint layer is fixed to another one of the wiring member and the adherend.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.

An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.