The present disclosure provides an antimicrobial composition that includes: an antimicrobial component having at least one quaternary ammonium compound; a synthetic polymer that includes: at least one cationic monomer A.sub.b, optionally, at least one anionic monomer B.sub.a, and optionally, at least one non-ionic monomer C.sub.a; an organic acid; and a surfactant selected from cationic surfactants, amphoteric surfactants and combinations thereof; and at least one non-ionic surfactant selected from the group consisting of low hydrophilic-lipophilic balance (HLB) non-ionic surfactants with a delocalized electronic structure that have moderate to poor water solubility. This composition when applied to a surface demonstrates good cleaning ability and provides robust long lasting disinfection.

The present invention provides acidic or basic cleaning compositions for use in cleaning food and beverage industry processing equipment and pharmaceutical and cosmetic industry processing equipment wherein the compositions of the invention comprise a food-equipment-safe acidic or basic cleaning compound and a food-equipment-safe colorimetric indicator of pH to show the desired acid or basic conditions during storage prior to the start of a cleaning cycle and after storage and during a cleaning cycle. The cleaning compositions of the invention are particularly useful in, for example, CIP cleaning processes.

The present invention is a method for removing a biofilm containing a metal and formed in a water system, wherein the biofilm is brought into contact with (a) a compound having a hydroxyl radical generation ability and (b) a reducing agent.

The present disclosure provides an antimicrobial composition that includes: an antimicrobial component having at least one quaternary ammonium compound; a synthetic polymer that includes: at least one cationic monomer A.sub.b, optionally, at least one anionic monomer B.sub.a, and optionally, at least one non-ionic monomer C.sub.a; an organic acid; and a surfactant selected from cationic surfactants, amphoteric surfactants and combinations thereof; and at least one non-ionic surfactant selected from the group consisting of low hydrophilic-lipophilic balance (HLB) non-ionic surfactants with a delocalized electronic structure that have moderate to poor water solubility. This composition when applied to a surface demonstrates good cleaning ability and provides robust long lasting disinfection.

There is provided a method of cleaning semiconductor substrates that is excellent in cleaning performance with respect to semiconductor substrates having undergone a chemical mechanical polishing process and corrosion prevention performance with respect to metal films. This method includes a cleaning step of cleaning a semiconductor substrate having undergone the CMP using a cleaning liquid. The cleaning liquid shows alkaline properties and contains: a component A that is at least one selected from the group consisting of a primary amine, a secondary amine, and a tertiary amine, provided that a compound represented by a specific formula (a) is excluded; and a component B that is a compound represented by the specific formula (a). The mass ratio of the component B content to the component A content is not more than 0.01. The cleaning liquid applied to the semiconductor substrate has a temperature of not lower than 30° C.

The present invention provides acidic or basic cleaning compositions for use in cleaning food and beverage industry processing equipment and pharmaceutical and cosmetic industry processing equipment wherein the compositions of the invention comprise a food-equipment-safe acidic or basic cleaning compound and a food-equipment-safe colorimetric indicator of pH to show the desired acid or basic conditions during storage prior to the start of a cleaning cycle and after storage and during a cleaning cycle. The cleaning compositions of the invention are particularly useful in, for example, CIP cleaning processes.

This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one chelating agent, the chelating agent being a polyaminopolycarboxylic acid; 3) at least one corrosion inhibitor, the corrosion inhibitor being a substituted or unsubstituted benzotriazole; 4) at least one sulfonic acid; and 5) water.

Provided is a cleaning solution composition which, when cleaning the surface of a semiconductor substrate or glass substrate, does not damage SiO.sub.2, Si.sub.3N.sub.4, Si, and the like forming a layer on the substrate surface, can be used under processing conditions applicable to a brush scrub cleaning chamber equipped with a CMP apparatus, and can efficiently remove compounds derived from abrasive particles in a slurry. This cleaning solution composition for cleaning the surface of a semiconductor substrate or glass substrate contains: one or two or more fluorine atom-containing inorganic acids or salts thereof; water; one or two or more reducing agents; and one or two or more anionic surfactants, and has a hydrogen ion concentration (pH) of less than 7.

The present invention generally relates to a removal composition and process, particularly useful for cleaning ceria particles and CMP contaminants from microelectronic devices having said particles and CMP contaminants thereon, in particular microelectronic devices having PETEOS, Silicon Nitride, and Poly-Si substrates. In one aspect, the invention provides treatment of the microelectronic substrate having ceria particles thereon utilizing complexing agents free of Sulfur and Phosphorous atoms.

The invention relates to enzyme containing water-soluble films, and their use in detergents.