The present invention relates to personal care compositions comprising malodor reduction compositions and methods of making and using such personal care compositions. Such personal care compositions comprising the malodor control technologies disclosed herein provide malodor control without leaving an undesireable scent and when perfume is used to scent such compositions, such scent is not unduely altered by the malodor control technology.

Non-fluorocarbon compositions for providing enhanced fluid repellency on various surfaces, including for laundry treatments in a finishing step of a laundry process, are disclosed. Non-fluorocarbon laundry treatment compositions and compositions including the non-fluorocarbon chemistries and a substrate surface are also disclosed along with methods of using the same in a laundry application.

Non-fluorocarbon compositions for providing enhanced fluid repellency on various surfaces, including for laundry treatments in a finishing step of a laundry process, are disclosed. Non-fluorocarbon laundry treatment compositions and compositions including the non-fluorocarbon chemistries and a substrate surface are also disclosed along with methods of using the same in a laundry application.

An object of the present invention is to provide a treatment liquid for a semiconductor device, which is excellent in removal performance for residues present on a substrate, and to provide a substrate washing method using the treatment liquid.

The treatment liquid of the present invention is a treatment liquid for a semiconductor device, which includes water, a basic compound, hexylene glycol, and a compound A that is at least one kind selected from the group consisting of isobutene, (E)-2-methyl-1,3-pentadiene, 4-methyl-1,3-pentadiene, 2,2,4-trimethyloxetane, 4-methyl-3-penten-2-ol, and 2,4,4,6-tetramethyl-1,3-dioxane.

A cleaning liquid composition is provided. More particularly, a cleaning liquid composition includes a transition metal compound represented by Chemical Formula 1 (see the detailed description of the present invention); and a hydrocarbon-based solvent, and a cleaning method of a polymerization apparatus using the same.

A cleaning liquid composition is provided. More particularly, a cleaning liquid composition includes a transition metal compound represented by Chemical Formula 1 (see the detailed description of the present invention); and a hydrocarbon-based solvent, and a cleaning method of a polymerization apparatus using the same.

An automotive surface is cleaned by applying an effective amount of a cleaning composition comprising a) at least one hydrocarbon solvent in an amount from about 3 weight percent to about 20 weight percent of the composition, b) at least one thickener/rheology modifier in an amount from about 0.01 weight percent to about 3 weight percent, c) at least one silicone fluid has a viscosity ranging from about 500 to about 20,000 centistokes at 25° C., present in an amount from about 0.1 weight percent to about 3 weight percent, d) at least one wetting agent in an amount from about 0.001 to about 2%, e) at least one hydrophobic additive in an amount from about 0.1 to about 3%, and f) water in an amount from about 60 weight percent to about 85 weight percent to the automotive surface with an application implement.

The invention provides for the use of specific microemulsions comprising quaternary ammonium compounds for production of clear fabric softener formulations having improved performance properties, and also the corresponding formulations and a process for production thereof.

The present invention relates to a composition for treating a semiconductor substrate, and particularly to a composition for treating an edge portion of a wafer coated with polysilazane.

According to the composition for treating a semiconductor substrate according to the present invention, it is possible to uniformly maintain the quality of the composition in terms of management and to uniformly treat the boundary of the wafer in terms of processing. In addition, by improving the straightness of the boundary portion where polysilazane is removed, it is possible to significantly reduce the defect rate of the product and to stably improve the productivity yield.

A cleaning device 2 is for performing a preliminary cleaning step 110 to a cleaning step 120 of a cleaning method 100, and includes a preliminary cleaning tank 11 containing a preliminary cleaning agent LQ1, a cleaning tank 12 containing a cleaning agent LQ2, an outer container 21 containing the preliminary cleaning tank 11 and the cleaning tank 12, a temperature adjustment unit 30 for adjusting the temperature of water WT contained in the outer container 21, an ultrasonic unit 40 for applying an ultrasonic wave to the water WT, or to the preliminary cleaning agent LQ1 or the cleaning agent LQ2 through the preliminary cleaning tank 11 or the cleaning tank 12, and a controller 80 controlling each of the units.