Patent classifications
C11D3/2058
FABRIC TREATMENT COMPOSITIONS WITH ANTIOXIDANTS
Fabric treatment compositions that include a treatment adjunct material and certain phenol antioxidants. Process of treating fabrics that include at least one source of malodor by contacting the fabric with such fabric treatment compositions. Premix compositions that include certain phenol antioxidants, and methods of making treatment compositions that include such premixes.
Stabilized compositions comprising leuco compounds
A composition comprising: (a) a leuco composition; and (b) a stabilizing amount of an antioxidant composition. The antioxidant composition comprises at least one sterically hindered phenol and at least one substituted diarylamine, and the mole ratio of the hindered phenol to the substituted diarylamine is greater than 1:1. In another embodiment, a composition comprises (a) a leuco composition and (b) an antioxidant composition; and optionally (c) a solvent composition. The combined mass of the leuco compounds and antioxidants present in the composition is 10% or more of the total mass of the composition, and (b) the molar ratio of antioxidants present in the composition to leuco compounds present in the composition is greater than 1:1.
Substrate processing method and substrate processing apparatus
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.
COMPOSITIONS CONTAINING ALKYL SULFATES AND/OR ALKOXYLATED ALKYL SULFATES AND A SOLVENT COMPRISING A DIOL
The present invention relates generally to compositions containing an anionic surfactant selected from the group consisting of alkyl sulfates, alkoxylated alkyl sulfates, and mixtures thereof, and a solvent, particularly a solvent comprising one or more diols.
COMPOSITIONS CONTAINING ALKYL SULFATES AND/OR ALKOXYLATED ALKYL SULFATES AND A SOLVENT COMPRISING A DIOL
The present invention relates generally to compositions containing an anionic surfactant selected from the group consisting of alkyl sulfates, alkoxylated alkyl sulfates, and mixtures thereof, and a solvent, particularly a solvent comprising one or more diols.
PARTICULATE LAUNDRY ADDITIVE
A composition including a plurality of particles. The plurality of particles include: about 25% to about 99% by weight water soluble carrier; and about 0.01% to 50% by weight antioxidant. The antioxidant is dispersed in a matrix of the water soluble carrier.
KIT FOR CLEANING AGENT AND METHOD FOR PREPARING CLEANING AGENT
The present invention addresses the problem of providing a kit for a cleaning agent, which is used for the purpose of preparing a cleaning agent that maintains, even after long-term storage, adequate impurity removal performance from the surface of a semiconductor substrate that has been subjected to a CMP process. The present invention also addresses the problem of providing a method for preparing the above-described cleaning agent. A kit for a cleaning agent according to the present invention is a kit for preparing a cleaning agent which is used for cleaning of a semiconductor substrate that has been subjected to a CMP process, and which has a pH of from 7.5 to 13.0. This kit for a cleaning agent comprises a first liquid that is acidic and contains a compound represented by formula (1) and a second liquid that is alkaline and contains a basic compound; and an acidic compound is contained in at least one of the first liquid and the second liquid.
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Cleaning solvent compositions and their use
A cleaning solvent composition comprises from about 0.2 to 15 weight percent of mono- or di-phosphate ester in free acid form, and from about 85 to 99.8 weight percent of one or more halogenated hydrocarbon solvents. Other cleaning solvent compositions further comprise one or more alcohols. For example, such alcohol-containing compositions may comprise from about 0.2 to 15 weight percent of mono- or di-phosphate ester in free acid form, from about 2 to about 25 weight percent of one or more alcohols, and from about 25 to about 97.8 weight percent of one or more halogenated hydrocarbon solvents.
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.
Substrate processing method and substrate processing apparatus
A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.