Embodiments of the present technology include molding processes for metallic foams, apparatuses, and products. An example method includes placing an uncompressed charge of conductive metal foam into a cavity disposed on a first tool, wherein the first tool is located on a first portion of a compression mold apparatus, translating the first portion of the compression mold apparatus towards a second portion of the compression mold apparatus so as to compress the uncompressed charge of conductive metal foam, creating a compressed charge of conductive metal foam, and overmolding around and through the compressed charge of conductive metal foam with an overmolding material.

Embodiments of the present technology include molding processes for metallic foams, apparatuses, and products. An example method includes placing an uncompressed charge of conductive metal foam into a cavity disposed on a first tool, wherein the first tool is located on a first portion of a compression mold apparatus, translating the first portion of the compression mold apparatus towards a second portion of the compression mold apparatus so as to compress the uncompressed charge of conductive metal foam, creating a compressed charge of conductive metal foam, and overmolding around and through the compressed charge of conductive metal foam with an overmolding material.