This application relates to a method of preparing a composite material for a semiconductor test socket, and a composite material prepared through the method. In one embodiment, the method includes preparing a powder mixture including (i) a metal powder comprising aluminum or aluminum alloy particles and magnesium particles and (ii) a polymer powder. The method may also include sintering the powder mixture to produce the composite material using a spark plasma sintering (SPS) process. This application also relates to a method of manufacturing a semiconductor test socket, the method including forming an insulating portion of the semiconductor test socket with the composite material. This application further relates to a semiconductor test socket produced through the method.

The present invention relates to a technique of dramatically improving a method for causing a molten metal of an Al alloy or the like to infiltrate without pressurization into a preform obtained by molding and hardening a ceramic powder, and obtaining “a metal matrix composite formed from a ceramic powder and an Al alloy or the like” in a uniform state as a whole more simply and stably, and the present invention provides “a production method for producing a metal matrix composite containing aluminum and ceramic, the method including: obtaining a mixed body by performing molding using a mixture containing a magnesium-containing powder, a ceramic powder, and an inorganic or organic/inorganic binder that is hardened when heated to 500° C. or lower; preparing a preform by calcining the mixed body at a temperature of 500° C. or lower; and causing an Al alloy or the like to infiltrate without pressurization into the obtained preform to produce the metal matrix composite containing aluminum and ceramic, and a method for preparing the preform.”

MMC’s comprising an Al—RE alloy-based matrix and ceramic, metal and/or intermetallic reinforcement particulates dispersed in the alloy matrix provide improved strength and ductility wherein the reinforcement particulates have a higher melting temperature than the matrix alloy.

The sheath (3) is a material, which includes an aluminium (Al) matrix, in which nanometric aluminium oxide particles (Al.sub.2O.sub.3) are homogenously dispersed, the content of Al.sub.2O.sub.3 is 0.25 to 5 vol. % and the balance is Al. It is preferred that Al.sub.2O.sub.3 originates from the surface layer present on Al powder used as feedstock material for consolidation. The superconductor based on magnesium diboride (MgB.sub.2) core (1) is fabricated by powder-in-tube or internal magnesium diffusion to boron technology, while the tube is the Al+Al.sub.2O.sub.3 composite, which is a product of powder metallurgy. A loose Al powder is pressed by cold isostatic pressing, and then the powder billet is degassed at elevated temperature and under vacuum, and then is hot extruded into a tube. A thin diffusion barrier (2) tube filled up with a mixture of Mg and B powders or Mg wire surrounded with B powder is placed into the Al+Al.sub.2O.sub.3 composite tube under inert gas or vacuum. Such composite unit is cold worked into a thin wire and then annealed at 625-655° C. for 8-90 min, what results in a formation superconducting MgB.sub.2 in a wire's core (1).

A composite containing hollow ceramic spheres and a preparation method are provided. The composite includes an impact-resistant gradient complex part containing a hollow ceramic sphere complex, prepared by using a 3D printing method and a hollow ceramic sphere-high polymer complex dielectric material obtained in a blending and fusing way. The obtained composite has the characteristics of relatively low density and high strength. The impact-resistant gradient complex part is a layered complex, the composition and properties of the complex may be regulated in a direction vertical to a layer according to a design, for example, mechanical properties of the complex are transitioned from soft to hard to form gradient change by regulating the change of the composition, and meanwhile, the thickness among layers with different properties is accurately controlled as required. The dielectric, heat conducting and mechanical properties of the hollow ceramic sphere-high polymer complex dielectric material are greatly improved.

A method for manufacturing a functionally graded composite material for a printed circuit board (PCB) is proposed. The method may include preparing two or more types of mixed powders with different contents of polymer or ceramic powder, each mixed powder comprising (i) a metal powder comprising a powder made of aluminum or an aluminum alloy and a powder of magnesium and (ii) the polymer or ceramic powder. The method may also include laminating the two or more types of mixed powders to form a functionally graded laminate in which a ratio of the content of the polymer or ceramic powder to the content of the metal powder in each of layers stacked in sequence from bottom to the top of the laminate differs. The method may further include preparing a functionally graded composite material by sintering the functionally graded laminate by pressureless sintering or spark plasma sintering.

Metallic matrix composites include a high strength titanium aluminide alloy matrix and an in situ formed aluminum oxide reinforcement. The atomic percentage of aluminum in the titanium aluminide alloy matrix can vary from 40% to 48%. Included are methods of making the metallic matrix composites, in particular, through the performance of an exothermic chemical reaction. The metallic matrix composites can exhibit low porosity.

A process for manufacturing ceramic-metal composite material, comprises dissolving ceramic powder into water to obtain an aqueous solution of ceramic; mixing metal powder having a multimodal particle size where largest particle size is one fourth of the minimum dimension of a device, with the aqueous solution of ceramic to obtain a powder containing ceramic precipitated on the surface of metal particles; mixing the powder containing ceramic precipitated on the surface of the metal particles, with ceramic powder having a particle size below 50μ.Math.τ.Math., to obtain a powder mixture; adding saturated aqueous solution of ceramic to the powder mixture to obtain an aqueous composition containing ceramic and metal; compressing the aqueous composition to form a disc of ceramic-metal composite material containing ceramic and metal; and removing water from the ceramic-metal composite material; wherein ceramic content of the disc is 10 vol-% to 35 vol-%. Alternatively, ceramic-ceramic composite material may be manufactured.

A ceramic reinforced metal composite (CRMC) comprising a composition composite as an interpenetrating network of at least two interconnected composites is described. The interpenetrating networks comprise a ceramic matrix composite (CMC) and a metal matrix composite (MMC). The composition composite is particularly useful as an electrically conductive pathway extending through the ceramic body of a hermetically sealed component, for example, a feedthrough in an active implantable medical device (AIMD).

A structured multi-phase composite which include a metal phase, and a low stiffness, high thermal conductivity phase or encapsulated phase change material, that are arranged to create a composite having high thermal conductivity, having reduced/controlled stiffness, and a low CTE to reduce thermal stresses in the composite when exposed to cyclic thermal loads. The structured multi-phase composite is useful for use in structures such as, but not limited to, high speed engine ducts, exhaust-impinged structures, heat exchangers, electrical boxes, heat sinks, and heat spreaders.