A cutting tool includes a substrate; and a coating film, wherein the coating film includes a multilayer structure layer having first unit layer(s) and second unit layer(s), the first unit layer(s) and the second unit layer(s) are alternately layered, under a condition X-ray diffraction intensities of different planes in the multilayer structure layer are respectively represented by I.sub.(200), I.sub.(111), and I.sub.(220), the following formula 0.6≤I.sub.(200)/{I.sub.(200)+I.sub.(111)+I.sub.(220)}, the first unit layer(s) has a NaCl-like structure in which an interplanar spacing d.sub.1c in a c-axis direction is larger than an interplanar spacing d.sub.1a in an a-axis direction, the second unit layer(s) has a NaCl-like structure in which an interplanar spacing d.sub.2c in the c-axis direction is smaller than an interplanar spacing d.sub.2a in the a-axis direction, and the following formulas are satisfied as well 1≤d.sub.1a/d.sub.2a≤1.02, 1.01≤d.sub.1c/d.sub.2c≤1.05, and d.sub.1a/d.sub.2a<d.sub.1c/d.sub.2c.

A cutting tool includes a substrate; and a coating film, wherein the coating film includes a multilayer structure layer having first unit layer(s) and second unit layer(s), the first unit layer(s) and the second unit layer(s) are alternately layered, under a condition X-ray diffraction intensities of different planes in the multilayer structure layer are respectively represented by I.sub.(200), I.sub.(111), and I.sub.(220), the following formula 0.6≤I.sub.(200)/{I.sub.(200)+I.sub.(111)+I.sub.(220)}, the first unit layer(s) has a NaCl-like structure in which an interplanar spacing d.sub.1c in a c-axis direction is larger than an interplanar spacing d.sub.1a in an a-axis direction, the second unit layer(s) has a NaCl-like structure in which an interplanar spacing d.sub.2c in the c-axis direction is smaller than an interplanar spacing d.sub.2a in the a-axis direction, and the following formulas are satisfied as well 1≤d.sub.1a/d.sub.2a≤1.02, 1.01≤d.sub.1c/d.sub.2c≤1.05, and d.sub.1a/d.sub.2a<d.sub.1c/d.sub.2c.

A hydrogen-free carbon film polymer lubricating material and a preparation method and use thereof are disclosed. In the method, a graphite target is used as the target material, and a magnetron sputtering deposition is performed on a surface of the polymer substrate, thereby physically depositing and forming a hydrogen-free carbon film on the surface of the polymer substrate, thereby obtaining a hydrogen-free carbon film polymer lubricating material.

A method of fabricating a magnetically-controlled graphene-based micro-/nano-motor includes: (a) mixing FeCl.sub.3 crystal powder with deionized water to obtain a FeCl.sub.3 solution; (b) completely immersing a carbon-based microsphere in the FeCl.sub.3 solution; transferring the carbon-based microsphere from the FeCl.sub.3 solution followed by heating to allow crystallization of FeCl.sub.3 on the surface of the carbon-based microsphere to obtain a FeCl.sub.3-carbon-based microsphere; (c) heating the FeCl.sub.3-carbon-based microsphere in a vacuum chamber until there is no moisture in the vacuum chamber; continuously removing gas in the vacuum chamber and introducing oxygen; and treating the FeCl.sub.3-carbon-based microsphere with a laser in an oxygen-enriched environment to obtain the magnetically controlled graphene-based micro-/nano-motor. A magnetically-controlled graphene-based micro-/nano-motor is further provided.

A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate. A meter section of a cooling aperture is formed in the substrate. An internal coating is applied onto a surface of the meter section. An external coating is applied over the substrate. A diffuser section of the cooling aperture is formed in the external coating and the substrate to provide the cooling aperture.

A method for fabricating an external element or a timepiece dial from non-conductive material, by performing or repeating a basic cycle of making a base from a non-conductive, or ceramic, or glass. or sapphire substrate; dry coating the base with a first sacrificial protective metal layer; etching a decoration with an ultrashort pulse laser to a depth at least equal to the local thickness of the first layer; dry coating the decoration and the remaining part of the first layer with a second metal and/or coloured decorative treatment layer; chemically removing each first layer; and before or after chemical removal of each first layer, mechanically levelling on the upper level of the base the compound thus formed.

Disclosed is a coating made of an organic material on a mold for glass molding. The coating comprises Cr.sub.xW.sub.yN.sub.(1-x-y), where 0.15<x<0.4, and 0.2≤y≤0.45. The coating has excellent high temperature resistance and anti-adhesion properties, thus being a promising coating material for molds.

Embodiments described herein provide for post deposition anneal of a substrate, having an amorphous carbon layer deposited thereon, to desirably reduce variations in local stresses thereacross. In one embodiment, a method of processing a substrate includes positioning a substrate, having an amorphous carbon layer deposited thereon, in a first processing volume, flowing an anneal gas into the first processing volume, heating the substrate to an anneal temperature of not more than about 450° C., and maintaining the substrate at the anneal temperature for about 30 seconds or more. Herein, the amorphous carbon layer was deposited on the substrate using a method which included positioning the substrate on a substrate support disposed in a second processing volume, flowing a processing gas into the second processing volume, applying pulsed DC power to a carbon target disposed in the second processing volume, forming a plasma of the processing gas, and depositing the amorphous carbon layer on the substrate.

Embodiments described herein provide for post deposition anneal of a substrate, having an amorphous carbon layer deposited thereon, to desirably reduce variations in local stresses thereacross. In one embodiment, a method of processing a substrate includes positioning a substrate, having an amorphous carbon layer deposited thereon, in a first processing volume, flowing an anneal gas into the first processing volume, heating the substrate to an anneal temperature of not more than about 450° C., and maintaining the substrate at the anneal temperature for about 30 seconds or more. Herein, the amorphous carbon layer was deposited on the substrate using a method which included positioning the substrate on a substrate support disposed in a second processing volume, flowing a processing gas into the second processing volume, applying pulsed DC power to a carbon target disposed in the second processing volume, forming a plasma of the processing gas, and depositing the amorphous carbon layer on the substrate.

Described herein are methods of filling features with tungsten, and related systems and apparatus, involving inhibition of tungsten nucleation. In some embodiments, the methods involve selective inhibition along a feature profile. Methods of selectively inhibiting tungsten nucleation can include exposing the feature to a direct or remote plasma. In certain embodiments, the substrate can be biased during selective inhibition. Process parameters including bias power, exposure time, plasma power, process pressure and plasma chemistry can be used to tune the inhibition profile. The methods described herein can be used to fill vertical features, such as in tungsten vias, and horizontal features, such as vertical NAND (VNAND) wordlines. The methods may be used for both conformal fill and bottom-up/inside-out fill. Examples of applications include logic and memory contact fill, DRAM buried wordline fill, vertically integrated memory gate/wordline fill, and 3-D integration using through-silicon vias.