An evaporator device incudes a crucible comprising an inlet through which solid material is introduced to the crucible, and an outlet through which vaporised material is released from the crucible. Vapours outgassed from molten material within the crucible are guided away from the outlet.

A solid material container for supplying solid materials housed inside by evaporating the solid materials, and includes a carrier gas introduction line, a first filling section that is filled with the solid material, a second filling section that is located in at least a part of an outer periphery of the first filling section, and is filled with the solid material, at least one tray-shaped third filling section that is disposed on the ceiling side of an interior of the solid material container, and a solid material lead-out line.

A device for vapor depositing metal is disclosed. The device includes a vapor-deposition chamber and a storage chamber. The storage chamber can be connected to the vapor-deposition chamber by an openable and closable isolating door. At least one storage unit configured to store at least one metal evaporation material is disposed in the storage chamber. At least one feeding unit in one-to-one correspondence with the at least one storage unit is disposed in the vapor-deposition chamber.

An object of the present invention is to provide active material particles excellent in ion uptake ability. The silicon-based active material particles according to the present invention comprise a layer structure. Here, the “silicon-based active material particles” are, for example, active material particles for forming a negative electrode of a lithium ion secondary battery. Examples of the active material particles for forming the negative electrode of the lithium ion secondary battery include so-called Si-based active materials such as silicon (Si), silicon oxide (SiO.sub.x), metal element-containing silicon oxide containing alkaline metal elements such as lithium (Li) and alkaline earth metal elements such as magnesium (Mg), silicon alloys. The thickness of the layer in the active material particles is preferably 1 μm or less. Here, the thickness of the layer is preferably 0.01 μm or more.

The invention relates to an evaporation cell (1) for vacuum evaporation chamber, the evaporation cell (1) comprising a crucible (5), the crucible (5) being adapted to receive a solid or liquid material to be sublimated or evaporated, heating means (3) to heat the material in the crucible, a nozzle (6) placed at an open end of the crucible (5), the nozzle (6) comprising a frustoconical portion (61) having an opening (60) adapted for the passage of a flow of evaporated or sublimated material towards the vacuum evaporation chamber, and a cover (7) placed on the nozzle (6), the cover (7) having an opening (70) arranged about the frustoconical portion (61) of the nozzle (6). According to the invention, the cover (7) has at least one frustoconical portion (71, 72, 73) arranged about the frustoconical portion (61) of the nozzle (6), the cover (7) forming a thermal barrier between the crucible (5) and the vacuum evaporation chamber.

A method to control the temperature of an electromagnetic pump in an apparatus wherein a liquid metal is supplied through a feed tube from a container adapted to contain a liquid metal to an evaporator device in a vacuum chamber, wherein the temperature of the electromagnetic pump is controlled by controlling one or more of the force exerted on the liquid metal in the container, the current of the electromagnetic pump, and/or the strength of the magnet field of the electromagnetic pump.

An effusion cell includes a crucible for containing material to be evaporated or sublimated, a delivery tube configured to deliver evaporated or sublimated material originating from the crucible into a chamber, a supply tube extending from the crucible, the supply tube located and configured to trap condensate originating from the evaporated or sublimated material and to deliver the condensate back to the crucible, and at least one heating element located and configured to heat material in the crucible so as to cause evaporation or sublimation of the material and flow of the evaporated or sublimated material through the delivery tube and out from the effusion cell. The effusion cell is configured such that the crucible can be filled with the material to be evaporated or sublimated without removing the effusion cell from the process vacuum chamber. Semiconductor substrate processing systems may include such effusion cells.

A coated metallic substrate including at least a first coating of aluminum, such first coating having a thickness below 5 μm and being directly topped by a second coating including from 0.5 to 5.9% by weight of magnesium, the balance being zinc.

A vacuum evaporation apparatus includes an evaporating source belt, a depositing substrate, a vacuum room, a laser beam source, and a mesh in the vacuum room. The mesh includes a first surface and a second surface. The first surface faces and is spaced from the laser beam source. The second surface faces the depositing substrate. A portion of the evaporating source belt is located between the laser beam source and the mesh. The portion of the evaporating source belt between the laser beam source and the mesh is parallel to and spaced from the depositing substrate.

The invention relates to a device for forming coatings on surfaces of a component, band-shaped material, or tool, in which at least one wire-shaped or band-shaped material (2.1 and/or 2.2) is used for forming the coating and that is/are connected to a direct electrical current source, wherein an electric arc is formed between wire-shaped materials (2.1 and 2.2) or between one wire-shaped or band-shaped material and one anode or cathode, wherein wire-shaped or band-shaped material (2.1 and/or 2.2) may be fed by means of a feed device; and melted and/or evaporated material of the wire-shaped or band-shaped material (2.1 and/or 2.2) flows, by means of a gas jet (3) of a gas or gas mixture, through an inlet into the interior of a chamber (4) that can be heated to a temperature that is at least equal to the evaporation temperature of the at least one material used for the coating or of the material with the highest evaporation temperature, and the material(s) completely evaporates and exits through at least one opening (5) present on the chamber (4) and impinges on the surface to be coated of the component or tool (6) for forming the coating.