Patent classifications
C23C18/02
SELECTIVE OXIDATION ON RAPID THERMAL PROCESSING (RTP) CHAMBER WITH ACTIVE STEAM GENERATION
Embodiments of gas distribution modules for use with rapid thermal processing (RTP) systems and methods of use thereof are provided herein. In some embodiments, a gas distribution module for use with a RTP chamber includes: a first carrier gas line and a first liquid line fluidly coupled to a mixer, the mixer having one or more control valves configured to mix a carrier gas from the first carrier gas line and a liquid from the first liquid line in a desired ratio to form a first mixture; a vaporizer coupled to the mixer and configured to receive the first mixture in a hollow internal volume, the vaporizer having a heater configured to vaporize the first mixture; and a first gas delivery line disposed between the vaporizer and the RTP chamber to deliver the vaporized first mixture to the RTP chamber.
Oriented perovskite crystals and methods of making the same
An aspect of the present disclosure is a method that includes combining a first organic salt (A.sup.1X.sup.1), a first metal salt (M.sup.1(X.sup.2).sub.2), a second organic salt (A.sup.2X.sup.3), a second metal salt (M.sup.2Cl.sub.2), and a solvent to form a primary solution, where A.sup.1X.sup.1 and M.sup.1(X.sup.2).sub.2 are present in the primary solution at a first ratio between about 0.5 to 1.0 and about 1.5 to 1.0, and A.sup.2X.sup.3 to M.sup.2Cl.sub.2 are present in the primary solution at a second ratio between about 2.0 to 1.0 and about 4.0 to 1.0. In some embodiments of the present disclosure, at least one of A.sup.1 or A.sup.2 may include at least one of an alkyl ammonium, an alkyl diamine, cesium, and/or rubidium.
Oriented perovskite crystals and methods of making the same
An aspect of the present disclosure is a method that includes combining a first organic salt (A.sup.1X.sup.1), a first metal salt (M.sup.1(X.sup.2).sub.2), a second organic salt (A.sup.2X.sup.3), a second metal salt (M.sup.2Cl.sub.2), and a solvent to form a primary solution, where A.sup.1X.sup.1 and M.sup.1(X.sup.2).sub.2 are present in the primary solution at a first ratio between about 0.5 to 1.0 and about 1.5 to 1.0, and A.sup.2X.sup.3 to M.sup.2Cl.sub.2 are present in the primary solution at a second ratio between about 2.0 to 1.0 and about 4.0 to 1.0. In some embodiments of the present disclosure, at least one of A.sup.1 or A.sup.2 may include at least one of an alkyl ammonium, an alkyl diamine, cesium, and/or rubidium.
IMPROVED PROCESS OF ULTRASONIC SPRAY PYROLYSIS DEPOSITION OF ONE OR MORE ELECTROCHROMIC AND/OR ELECTROLYTIC FILMS ON A SUBSTRATE
A process of making an electrochromic or an electrolytic film by Ultrasonic Spray Pyrolysis (USP) deposition on a substrate comprising: mixing a surfactant to an aqueous precursor solution comprising an electrochromic component or an electrolytic component to provide a spray solution; introducing the spray solution into an ultrasonic spray deposition nozzle at a constant flow rate between 0.1 mL/min and 2 mL/min and applying an ultrasonic frequency between 80 and 120 kHz to generate atomized droplets of the precursor solution; entraining the atomized droplets with a controlled jet of air as gas carrier at a pressure between 0.50 to 2.0 psi, onto a pre-heated substrate at a temperature of 200 to 450° C.; thermally converting the atomized droplets when depositing onto the pre-heated substrate to generate an electrochromic or an electrolytic film.
Method for forming conductive mesh pattern, and mesh electrode and laminate manufactured thereby
The present invention relates to a method for manufacturing a conductive mesh pattern, a mesh electrode manufactured by the same, and a laminate.
PLATING METHOD
The present invention provides a plating method capable of easily performing various decorative plating processes. The plating method includes a bulge forming process of forming a bulge on an object to be plated by ejecting ink drops of first UV-curable ink from an inkjet head such that the ejected ink drops land on the object, and a plating process of plating the object having the bulge formed thereon, after the bulge forming process. Also, in the bulge forming process, the bulge is formed such that a second surface of the bulge to be plated has surface roughness different from that of a first surface of the object to be plated.
Method for producing member for molten metal bath
It is an object to provide a method for producing a member for a molten metal bath which is less likely to form minute cracks and pores in a pores-sealing coating film, and to provide a method for producing a member for a molten metal bath which can restrain adhesion of an alloy such as dross. The method for producing a member for a molten metal bath is characterized by applying or spraying, to a cermet thermal spray coating film formed on a base material or an oxide-based ceramic thermal spray coating film formed on a base material, a mixed solution obtained by adding aluminum dihydrogen phosphate and inorganic particles having a layered hexagonal crystal structure to a silica sol solution as a solution for sealing pores of the thermal spray coating film, and firing the mixed solution which is applied or sprayed to the thermal spray coating film.
Method for producing member for molten metal bath
It is an object to provide a method for producing a member for a molten metal bath which is less likely to form minute cracks and pores in a pores-sealing coating film, and to provide a method for producing a member for a molten metal bath which can restrain adhesion of an alloy such as dross. The method for producing a member for a molten metal bath is characterized by applying or spraying, to a cermet thermal spray coating film formed on a base material or an oxide-based ceramic thermal spray coating film formed on a base material, a mixed solution obtained by adding aluminum dihydrogen phosphate and inorganic particles having a layered hexagonal crystal structure to a silica sol solution as a solution for sealing pores of the thermal spray coating film, and firing the mixed solution which is applied or sprayed to the thermal spray coating film.
NANOPARTICLES AND SYSTEMS AND METHODS FOR SYNTHESIZING NANOPARTICLES THROUGH THERMAL SHOCK
Systems and methods of synthesizing nanoparticles on substrates using rapid, high temperature thermal shock. A method involves depositing micro-sized particles or salt precursors on a substrate, and applying a rapid, high temperature thermal pulse or shock to the micro-sized particles or the salt precursors and the substrate to cause the micro-sized particles or the salt precursors to become nanoparticles on the substrate. A system may include a rotatable member that receives a roll of a substrate sheet having micro-sized particles or salt precursors; a motor that rotates the rotatable member so as to unroll consecutive portions of the substrate sheet from the roll; and a thermal energy source that applies a short, high temperature thermal shock to consecutive portions of the substrate sheet that are unrolled from the roll by rotating the first rotatable member. Some systems and methods produce nanoparticles on existing substrate. The nanoparticles may be metallic, ceramic, inorganic, semiconductor, or compound nanoparticles. The substrate may be a carbon-based substrate, a conducting substrate, or a non-conducting substrate. The high temperature thermal shock process may be enabled by electrical Joule heating, microwave heating, thermal radiative heating, plasma heating, or laser heating.
SUBSTRATE TREATING METHOD
Disclosed is a substrate treating method for treating a substrate. The substrate treating method includes a dehydrating step, a dispensing step (mixed liquid dispensing step), a solidified film forming step, and a sublimation step. In the dehydrating step, a mixed liquid is dehydrated. The mixed liquid contains a sublimable substance and a solvent. In the dispensing step, the mixed liquid dehydrated in the dehydrating step is dispensed onto an upper surface of the substrate. In the solidified film forming step, the solvent evaporates from the mixed liquid on the upper surface of the substrate. In the solidified film forming step, a solidified film containing the sublimable substance is formed on the upper surface of the substrate. In the sublimation step, the solidified film sublimates.