A process for depositing a coating on short fibres of carbon or silicon carbide from a coating precursor, the short fibres having a length of between 50 μm and 5 mm, the process including at least heating the short fibres by placing a mixture including the fibres and a liquid phase of the coating precursor in a microwave field so as to bring the surface of the fibres to a temperature allowing the coating on the fibres from the coating precursor to be formed by calefaction.

A process for depositing a coating on short fibres of carbon or silicon carbide from a coating precursor, the short fibres having a length of between 50 μm and 5 mm, the process including at least heating the short fibres by placing a mixture including the fibres and a liquid phase of the coating precursor in a microwave field so as to bring the surface of the fibres to a temperature allowing the coating on the fibres from the coating precursor to be formed by calefaction.

Vacuum-integrated photoresist-less methods and apparatuses for forming metal hardmasks can provide sub-30 nm patterning resolution. A metal-containing (e.g., metal salt or organometallic compound) film that is sensitive to a patterning agent is deposited on a semiconductor substrate. The metal-containing film is then patterned directly (i.e., without the use of a photoresist) by exposure to the patterning agent in a vacuum ambient to form the metal mask. For example, the metal-containing film is photosensitive and the patterning is conducted using sub-30 nm wavelength optical lithography, such as EUV lithography.

The present invention provides an apparatus for the deposition of thin films on a substrate, including large substrates, held preferably face-down, in a cartridge containing a liquid solution with at least a chemical precursor which, upon being subject to a uniform microwave field transmitted through a microwave-transparent window, leads to the formation of a thin film on the substrate. The present invention also provides a system for launching microwaves and controlling the process for film deposition on the substrate. The present invention also provides a process for obtaining a film of uniform thickness and characteristics on a substrate or for incorporating controlled non-uniformity. The present invention also provides an apparatus and method for film deposition on a series of substrates in a continuous batch process.

The present invention provides an apparatus for the deposition of thin films on a substrate, including large substrates, held preferably face-down, in a cartridge containing a liquid solution with at least a chemical precursor which, upon being subject to a uniform microwave field transmitted through a microwave-transparent window, leads to the formation of a thin film on the substrate. The present invention also provides a system for launching microwaves and controlling the process for film deposition on the substrate. The present invention also provides a process for obtaining a film of uniform thickness and characteristics on a substrate or for incorporating controlled non-uniformity. The present invention also provides an apparatus and method for film deposition on a series of substrates in a continuous batch process.

A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.

Embodiments of the present disclosure provide for methods and systems for making structures using an electrospray system while under vacuum. In particular, embodiments of the present disclosure provide for methods and systems for ultra-fast growth of high aspect ratio nano/meso/micro-structures with three dimensional topological complexity and control of phase and composition of the structure formed.

A coating liquid for forming a metal oxide film, the coating liquid including: a metal source, which is at least one selected from the group consisting of inorganic salts, oxides, hydroxides, metal complexes, and organic acid salts; at least one alkali selected from the group consisting of organic alkalis and inorganic alkalis; and a solvent.

A composition for forming a patterned thin metal film on a substrate is presented. The composition includes metal cations; and at least one solvent, wherein the patterned thin metal film is adhered to a surface of the substrate upon exposure of the at least metal cations to a low-energy plasma.

Embodiments of the present disclosure provide for methods and systems for making structures using an electrospray system while under vacuum. In particular, embodiments of the present disclosure provide for methods and systems for ultra-fast growth of high aspect ratio nano/meso/micro-structures with three dimensional topological complexity and control of phase and composition of the structure formed.