The present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise forming a structure using a flowable first material, adapted to form a glass, which includes a metal component. The structure is then treated to remove substantially all solvents and organic components contained in the first flowable material. Finally, the structure is exposed to a bath of a metal salt during which nucleation occurs and a metallized surface coating is formed on at least a portion of an outer surface of the structure.

A substrate having a recess, a diffusion barrier layer defining the recess, and a wiring exposed at a bottom of the recess is prepared. A metal ion, having a concentration not causing precipitation of a metal even when an electroless plating liquid comes into contact therewith, is attached to the diffusion barrier layer. The metal is precipitated in the recess by supplying the electroless plating liquid into the recess in a state that the metal ion is attached to the diffusion barrier layer.

A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

Some devices and systems comprise one or more walls of a reaction chamber; an adjustable gap in the one or more walls, wherein the adjustable gap is formed between a first gap surface and a second gap surface facing the first gap surface, and wherein a distance between the first gap surface and the second gap surface is adjustable; a plurality of stops, wherein each stop of the plurality of stops is positioned on either the first gap surface or the second gap surface, wherein the plurality of stops ensure a minimum distance of the adjustable gap, wherein a total length of the plurality of stops is less than 1% of a length of the first gap surface; and one or more vacuum ports in the first gap surface or the second gap surface.

A plating method includes: a mask forming step of discharging a SUV curable ink from an ink jet head in the form of ink droplets and having the ink droplets land on an object to be plated to form a plating mask on the object to be plated; and a plating step of plating the object to be plated subsequent to the mask forming step. In the mask forming step, the ink droplets are discharged so as to have adjacent ones of the ink droplets contact one another.

The invention eliminates defects generated in a metal filling a through hole of a printed board by changing an angle at which a plating solution is sprayed or by changing a posture of the printed board at a time point in a process of precipitating the metal from the plating solution and filling the through hole with the precipitated metal while the plating solution or air bubbles are being sprayed onto the printed board.

A system for electroless deposition on a substrate is provided, including the following: a chamber; a substrate support configured to receive a substrate having a conductive layer disposed on a top surface of the substrate, the top surface of the substrate having an edge exclusion region and a process region, wherein the substrate support is configured to rotate the substrate; a solution container configured to hold an electroless deposition solution; a dispenser configured to provide a flow of the electroless deposition solution; a controller, the controller configured to direct the flow of the electroless deposition solution toward the edge exclusion region while the substrate is rotated, the flow being directed away from the process region, the electroless deposition solution plates metallic material over the conductive layer at the edge exclusion region, to produce an increased thickness of the metallic material that reduces electrical resistance.

The present disclosures provide a deposition mask and a method of manufacturing the same. The disclosed deposition mask may include: a deposition portion including a plurality of deposition patterns; and a boundary portion surrounding the deposition portion and including a first region and a second region extending from the first region. The boundary portion may have a thickness thicker than that of the deposition portion. Through this, it is possible to prevent a thermal deformation of the mask which may occur when the mask and mask frame are welded to each other.

A catalyst solution for electroless plating is provided. The catalyst solution is printable and devoid of an amine. The catalyst solution comprises a catalytic metal salt, a solvent, and an epoxy.

A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.