The present invention relates to an apparatus (1) for the electroless metallization of a target surface of at least one workpiece (5), having a vessel (10) to accommodate a metallization solution having an inlet (15) and an outlet (16) for the metallization solution, and a holder (20) for accommodating the at least one workpiece (5) and can be arranged within the vessel (10), wherein at least one diffuser plate (30) is provided between the at least one inlet (15) and the holder (20) and has a multitude of diffuser openings (35) spaced apart in a plane of a plate (E), and wherein a movement device (40) is provided, which can move the diffuser plate (30) in at least one spatial direction in the vessel (10). The present invention further relates to a method for the electroless metallization of the target surface of the at least one workpiece (5).

An assembly for electroless metallization of a target surface (11) of at least one workpiece (10), comprising—a container (13) for receiving an electrolyte solution—an inlet for the electrolyte solution, said inlet arranged in the base (15) of the container (13), wherein the inlet (20) is designed as an inlet port (21) with a diffuser plate (24) comprising inlet openings (25) arranged in concentric circles—an outlet (30) which is arranged on an upper side of the container (13)—a receiving area for holding the at least one workpiece (10), wherein the diffuser plate (24) is formed as a first assembly (31) and a second assembly (32), which is identical to the first assembly, of a respective plurality of inlet openings (25), wherein the assemblies at least partially but not completely overlap, and the inlet (20) has at least two inlet ports (21, 22).

A cartridge assembly, a jig, a jig assembly and an apparatus for electroless plating are disclosed. The cartridge includes a first cartridge and a second cartridge. The first cartridge includes a holder disposed at a corner thereof, and the holder is formed to protrude toward the second cartridge. The second cartridge includes an accommodating portion disposed at a corner thereof, and the accommodating portion accommodates at least a portion of the holder.

A technique enabling to heat a plating liquid rapidly while suppressing thermal deterioration of the plating liquid is provided. A substrate liquid processing apparatus includes a substrate holder configured to hold a substrate; a plating liquid supply configured to supply the plating liquid on a processing surface of the substrate; and a heating element, configured to heat at least one of the plating liquid on the processing surface or the substrate, including a heater, a liquid flow path through which pure water flows, and a vapor discharge opening which is connected to the liquid flow path and through which water vapor produced as the pure water is vaporized by heat from the heater is ejected.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

A technique of improving an adhesion between a metal precipitated in a recess of a substrate and a surface partitioning the recess in an electroless plating processing in which a plated metal is deposited from the bottom of the recess is provided. A substrate liquid processing method includes preparing a substrate including a recess and a wiring exposed at a bottom of the recess; forming a self-assembled monolayer on a side wall of the recess; attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer; and burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess, the metal in the recess while bringing the metal into close contact with the intermolecular binder.

Systems and methods for electroless plating a first metal onto a second metal in a molten salt bath including: a bath vessel holding a dry salt mixture including a dry salt medium and a dry salt medium of the first metal, and without the reductant therein, the dry salt mixture configured to be heated to form a molten salt bath; and the second metal is configured to be disposed in the molten salt bath and receive a pure coating of the first metal thereon by electroless plating in the molten salt bath, wherein the second metal is more electronegative than the first metal.

A substrate processing apparatus 5 includes a holder 52 (52A), a supply 53 and a cover body 6. The holder 52 (52A) is configured to attract and hold a substrate W. The supply 53 is configured to supply a heated plating liquid to the substrate W attracted to and held by the holder 52 (52A). The cover body 6 is configured to cover the substrate W attracted to and held by the holder 52 (52A), and heat the plating liquid on the substrate W by using a heating device 63 provided in a ceiling member 61 thereof facing a top surface of the substrate W. The holder 52 (52A) includes protrusions 130 projecting from a facing surface 110 thereof facing a bottom surface of the substrate W toward the bottom surface of the substrate W, and each protrusion has a protruding height equal to or larger than 1 mm.

A substrate having a recess, a diffusion barrier layer defining the recess, and a wiring exposed at a bottom of the recess is prepared. A metal ion, having a concentration not causing precipitation of a metal even when an electroless plating liquid comes into contact therewith, is attached to the diffusion barrier layer. The metal is precipitated in the recess by supplying the electroless plating liquid into the recess in a state that the metal ion is attached to the diffusion barrier layer.

A substrate processing method includes holding a substrate W by using a holder 52 configured to hold the substrate; supplying a plating liquid L onto a top surface of the held substrate; covering the substrate by using a cover body 6 before or after the supplying of the plating liquid; heating the plating liquid on the substrate by using a heating device 63 provided in the cover body, while keeping the substrate covered with the cover body; and supplying a cooling gas to a bottom surface of the substrate or the holder from below the substrate in the heating of the plating liquid.