A cartridge assembly, a jig, a jig assembly and an apparatus for electroless plating are disclosed. The cartridge includes a first cartridge and a second cartridge. The first cartridge includes a holder disposed at a corner thereof, and the holder is formed to protrude toward the second cartridge. The second cartridge includes an accommodating portion disposed at a corner thereof, and the accommodating portion accommodates at least a portion of the holder.

A substrate liquid processing method includes holding a substrate W with a substrate holder 52; supplying a plating liquid L1 onto a top surface of the substrate; covering the substrate with a cover body 6 disposed above the held substrate, the cover body having a ceiling portion 61; and heating the plating liquid on the substrate by a heating unit 63 provided in either one of at least the cover body and the substrate holder in a state that the substrate is covered with the cover body. A gas exhausting operation of pushing out a reaction gas staying between the cover body and the substrate by moving either one of at least the cover body and the substrate holder vertically is performed in the heating of the plating liquid.

A plating apparatus, a plating method and a recording medium can allow a temperature of a wafer to be uniform within a surface thereof. A plating apparatus 1 includes a substrate holding unit 52 configured to hold a substrate W; a plating liquid supply unit 53 configured to supply a plating liquid M1 to the substrate W; and a solvent supply unit 55a configured to supply a solvent N1 having a different temperature from a temperature of the plating liquid M1 to the substrate W. The solvent N1 is supplied to a preset position on the substrate W from the solvent supply unit 55a after the plating liquid M1 is supplied to the substrate W from the plating liquid supply unit 53.

Provided is a method for forming a metal film capable of forming a homogeneous metal film having a uniform film thickness by stably ensuring a fluid pressure of an electrolytic solution during film formation. The method places a substrate on a mount base. While sucking a gas between the substrate and a porous film through which the electrolytic solution can pass from a suction port of a suction passage formed on the mount base, the method brings the porous film into contact with the surface of the substrate. The method interrupts the suction passage while the porous film contacts the surface of the substrate. While interrupting the suction passage, the method allows the electrolytic solution to pass through the porous film while pressing the porous film against the surface of the substrate with a fluid pressure of the electrolytic solution and deposits metal from metal ions in the passed electrolytic solution on the surface of the substrate, thereby forming the metal film.

A technique of improving an adhesion between a metal precipitated in a recess of a substrate and a surface partitioning the recess in an electroless plating processing in which a plated metal is deposited from the bottom of the recess is provided. A substrate liquid processing method includes preparing a substrate including a recess and a wiring exposed at a bottom of the recess; forming a self-assembled monolayer on a side wall of the recess; attaching an intermolecular binder, which is allowed to be bonded to both a metal and the self-assembled monolayer, to the self-assembled monolayer; and burying, by supplying an electroless plating solution to the recess in a state where the intermolecular binder is attached to the self-assembled monolayer to precipitate the metal in the recess, the metal in the recess while bringing the metal into close contact with the intermolecular binder.

A system for jetting metal is also disclosed, which includes a nozzle orifice in connection with the inner cavity and configured to eject one or more droplets of liquid metal, a source of printing material located external to the ejector, and an alloying system located between the source of printing material and the ejector. A method for metal jetting is disclosed, which includes introducing a printing material from a feed source into an alloying system. The method for metal jetting also includes depositing an alloying material within the alloying system onto the printing material to produce an alloyed printing material, introducing the alloyed printing material into an ejector defining a cavity which can retain a printing material, melting the alloyed printing material in the cavity of the ejector, ejecting the alloyed printing material from the ejector.

A substrate processing method includes holding a substrate W by using a holder 52 configured to hold the substrate; supplying a plating liquid L onto a top surface of the held substrate; covering the substrate by using a cover body 6 before or after the supplying of the plating liquid; heating the plating liquid on the substrate by using a heating device 63 provided in the cover body, while keeping the substrate covered with the cover body; and supplying a cooling gas to a bottom surface of the substrate or the holder from below the substrate in the heating of the plating liquid.

Provided is a substrate holder and a substrate treatment apparatus capable of positioning a substrate even in a case in which the substrate receives a frictional force and the like from a support surface. A substrate holder 200 according to the present invention includes: a first holding member 300; a second holding member 500 adapted to pinch a substrate W with the first holding member 300; three or more positioning members 360 including contact surfaces 342 that come into contact with side end portions of the substrate W; a first moving member 380 including a plurality of engaging portions 384 that are engaged with the positioning members 360 such that the positioning members 360 with a state in which distances of an ideal axis L and contact surfaces 376 of the positioning members 360 are equal to each other maintained; and a first biasing member 310 adapted to bias the first moving member 380, in which the first moving member 380 delivers a biasing force of the first biasing member 310 to each of the positioning members 360, and the positioning members 360 are biased in a direction in which the contact surfaces 376 approaches the ideal axis L with the delivered biasing force.

A plating method can improve adhesivity with a substrate. The plating method of performing a plating process on the substrate includes forming a vacuum-deposited layer 2A on the substrate 2 by performing a vacuum deposition process on the substrate 2; forming an adhesion layer 21 and a catalyst adsorption layer 22 on the vacuum-deposited layer 2A of the substrate 2; and forming a plating layer stacked body 23 having a first plating layer 23a and a second plating layer 23b which function as a barrier film on the catalyst adsorption layer 22 of the substrate 2. By forming the vacuum-deposited layer 2A, a surface of the substrate 2 can be smoothened, so that the vacuum-deposited layer 2A serving as an underlying layer can improve the adhesivity.

Atomic layer etching (ALE) enables effective filling of small feature structures on semiconductor and other substrates, such as contacts and vias, by bottom-up fill, for example electroless deposition (ELD) of cobalt.