A method produces a composite from a conductive structure, a carrier made of non-conductive carrier material made from thermosetting plastic, and at least one electronic component by laser radiation. The non-conductive carrier material having an additive, which is configured to subsequently form a catalytically active species in an electroless metallization bath by irradiation with the laser radiation. The method includes: forming the conductive structure being by irradiation using pulsed laser radiation having a pulse duration of less than 100 picoseconds and subsequent electroless metallization. A pulse repetition rate is set such that consecutive pulses of the pulsed laser radiation in an area of the additive to be activated or an additive area are diverted mutually overlapping onto the additive or the additive area.

The invention relates to a thermoplastic polymer composition comprising A. a polyamide B. a reinforcing agent, and C. an laser direct structuring (LDS) additive wherein the polyamide comprises a blend of —(A.1) a semi-crystalline semi-aromatic polyamide, and —(A.2) an amorphous semi-aromatic polyamide or an aliphatic polyamide, or a mixture thereof; or a blend of —(A.3) a semi-crystalline aliphatic polyamide, and —(A.4) an amorphous semi-aromatic polyamide; and D. a metal (di)phosphinate. The present invention further relates an article prepared form the thermoplastic polymer composition, and article made by a LDS process and a process for preparing the same.

A method for patterning a metal layer on a substrate is disclosed. Furthermore, a kit comprising a first composition comprising a reducing agent and a second composition comprising a metal salt, and an article comprising a substrate in contact with a metal layer are also disclosed.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.

Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.

A method for patterning a metal layer on a substrate is disclosed. Furthermore, a kit comprising a first composition comprising a reducing agent and a second composition comprising a metal salt, and an article comprising a substrate in contact with a metal layer are also disclosed.

A patterning process, comprises: (i) forming a radiation-sensitive film on a substrate, wherein the radiation-sensitive film comprises: (a) a resin, (b) a photoacid generator, (c) a first quencher, and (d) a second quencher; (ii) patternwise exposing the radiation-sensitive film to activating radiation; and (iii) contacting the radiation-sensitive film with an alkaline developing solution to form a resist pattern; wherein the resin comprises the following repeat units: ##STR00001##
wherein: R.sub.1 is selected from a hydrogen atom, an alkyl group having from 1 to 4 carbon atoms, a cyano group or a trifluoromethyl group; Z is a non-hydrogen substituent that provides an acid-labile moiety; n is from 40 to 90 mol %; m is from 10 to 60 mol %; and the total combined content of the two repeat units in the resin is 80 mol % or more based on all repeat units of the resin; and the first quencher is selected from benzotriazole or a derivative thereof.

A patterning process, comprises: (i) forming a radiation-sensitive film on a substrate, wherein the radiation-sensitive film comprises: (a) a resin, (b) a photoacid generator, (c) a first quencher, and (d) a second quencher; (ii) patternwise exposing the radiation-sensitive film to activating radiation; and (iii) contacting the radiation-sensitive film with an alkaline developing solution to form a resist pattern; wherein the resin comprises the following repeat units:

##STR00001##

wherein: R.sub.1 is selected from a hydrogen atom, an alkyl group having from 1 to 4 carbon atoms, a cyano group or a trifluoromethyl group; Z is a non-hydrogen substituent that provides an acid-labile moiety; n is from 40 to 90 mol %; m is from 10 to 60 mol %; and the total combined content of the two repeat units in the resin is 80 mol % or more based on all repeat units of the resin; and the first quencher is selected from benzotriazole or a derivative thereof.

Disclosed herein are methods comprising: illuminating a first location of an optothermal substrate with electromagnetic radiation; wherein the optothermal substrate converts at least a portion of the electromagnetic radiation into thermal energy; and wherein the optothermal substrate is in thermal contact with a liquid sample comprising a plurality of thermally reducible metal ions; thereby: generating a confinement region at a location in the liquid sample proximate to the first location of the optothermal substrate; trapping at least a portion of the plurality of thermally reducible metal ions within the confinement region; and thermally reducing the trapped portion of the plurality of thermally reducible metal ions; thereby: depositing a metal particle on the optothermal substrate at the first location. Also disclosed herein are systems for performing the methods described herein. Also disclosed herein are patterned substrates made by the methods described herein, and methods of use thereof.