A method for selective metallization includes: selectively adsorbing catalytic nanoparticles onto an imprint mold to form a selectively adsorbed catalytic nanoparticle (SACN) mold; using the SACN mold in an imprinting process to synchronously transfer a pattern and the catalytic nanoparticles onto a film; separating the film from the SACN mold; and selectively depositing metal onto the film based on the pattern transferred to the film.

According to one aspect of the present disclosure, a base material for a printed circuit board includes: an insulating base film; a sintered body layer that is layered on at least one surface of the base film and that is formed of a plurality of sintered metal particles; and an electroless plating layer that is layered on a surface of the sintered body layer that is opposite to the base film, wherein an area rate of sintered bodies of the metal particles in a cross section of the sintered body layer is greater than or equal to 50% and less than or equal to 90%.

Provides a focal-plane shutter comprising: a base plate that has an opening portion for exposure; a blade group for opening and closing the opening portion; an arm that is linked to a blade group; and a driving mechanism portion, linked to the arm, for driving the blade group through the arm, wherein: the blade group and the arm are linked through a coupling plated with a metal crystallized structure with crystallization degree of no less than 99%. This focal-plane shutter can improve the wear durability of a coupling for linking a blade group and an arm. This can prevent the production of wear debris, and prevent the coupling from becoming brittle through wear, even given repeated operations.

The present invention is a stainless steel material having antibacterial properties and antiviral properties, the stainless steel material containing a Cu-rich region 3 in which the concentration of Cu is higher than the average Cu concentration in a matrix along grain boundaries in a surface 1 of the stainless steel material and a surface layer 2 located immediately below the surface of the stainless steel material, wherein the Cu-rich region 3 has Cu grain boundary layers 6 that extend continuously at a depth of 10 m to 200 m from the surface 1 of the stainless steel material, the average number of the Cu grain boundary layers 6 is 2.0 or more per 100 m of a distance parallel to the surface of the stainless steel material in a cross section orthogonal to the surface of the stainless steel material.

The method for coating a substrate with silver nanoparticles includes reducing a silver nitrate solution with an ethanol extract of the traditional Indian medicinal plant (Curcuma Longa L.), a naturally abundant antioxidant, to form a final solution, and contacting the final solution with the substrate to provide the silver nanoparticle coating. Formation of the silver nanoparticle coating on the substrate can be determined when a mirror in the final solution is observed. The thickness of the coating layer can be less than 125 nm. The coated substrates can be highly conductive.

Provides a focal-plane shutter comprising: a base plate that has an opening portion for exposure; a blade group for opening and closing the opening portion; an arm that is linked to a blade group; and a driving mechanism portion, linked to the arm, for driving the blade group through the arm, wherein: the blade group and the arm are linked through a coupling plated with a metal crystallized structure with crystallization degree of no less than 99%. This focal-plane shutter can improve the wear durability of a coupling for linking a blade group and an arm. This can prevent the production of wear debris, and prevent the coupling from becoming brittle through wear, even given repeated operations.

The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

A plating solution for electroless plating is disclosed, the solution including a metal salt, a reducing agent, a complexing agent, and a dispersion including polytetrafluoroethylene (PTFE) particulate matter and at least one particulate matter stabilizer, where said dispersion includes 400 parts per million or less of perfluorooctanoic acid (PFOA), and said dispersion is usable for an electroless plating bath to form a coating including PTFE particulate matter on an article.

A method for preventing corrosion in a component of a turbo-machine having a metal substrate made of carbon steel, low alloy steel and stainless steel includes: a first deposition step of depositing a first metallic layer on the substrate by electroplating; a second deposition step of depositing at least a second layer of a nickel alloy on the first layer by electroless plating; at least one thermal treatment step after the deposition steps, said thermal treatment being applied at a temperature and for a time depending on the overall thickness of the layers, the value of said temperature being directly proportional to the thickness, the value of said time being inversely proportional to the temperature.

The method for coating a substrate with silver nanoparticles includes reducing a silver nitrate solution with an ethanol extract of the traditional Indian medicinal plant (Curcuma Longa L.), a naturally abundant antioxidant, to form a final solution, and contacting the final solution with the substrate to provide the silver nanoparticle coating. Formation of the silver nanoparticle coating on the substrate can be determined when a mirror in the final solution is observed. The thickness of the coating layer can be less than 125 nm. The coated substrates can be highly conductive.