C23C18/1689

CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD
20230010064 · 2023-01-12 ·

A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.

PROCESS OF FORMING A PHOTOACTIVE LAYER OF AN OPTOELECTRONIC DEVICE

A process of forming a thin film photoactive layer of an optoelectronic device comprising: providing a substrate having a surface comprising or coated with a metal M selected from at least one of Pb, Sn, Ge, Si, Ti, Bi, or In; and converting the metal surface or metal coating of the substrate to a perovskite layer.

Method for forming nickel plated graphene hollow sphere

A method for forming a nickel plated graphene hollow sphere is based on self assembly of graphene under the actions of a rotation force and the van der Waals force, and an electroless nickel plating process performed on the exposed surface of the graphene by means of a hydrothermal method. The method is simple to implement at low cost, and the nickel plated graphene hollow sphere product can be produced with good reproducibility and a high yield. The nickel plated graphene hollow sphere formed by the present method can exhibit good electromagnetic wave absorbing performances of both nickel and graphene, and may have a lower overall density.

Methods of preparing articles by electrodeposition and additive manufacturing processes

Articles prepared by additive manufacturing of preforms that are coated by electrodeposition of nanolaminate materials, and methods of their production are described.

Thermal spraying of ceramic materials comprising metal or metal alloy coating
11697880 · 2023-07-11 · ·

A process comprising: (i) coating particles of silicon carbide, silicon nitride, boron carbide or boron nitride with a metal alloy or metal layer; (ii) agglomerating the particles of step (i); thermally spraying the agglomerated metal or metal alloy coated particles onto a substrate to provide a coating thereon.

Metal-coated reactive powders and methods for making the same
11542605 · 2023-01-03 · ·

The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

SYSTEMS AND METHODS FOR MANUFACTURING

Various inventions are disclosed in the microchip manufacturing arts. Conductive pattern formation by semi-additive processes are disclosed. Further conductive patterns and methods using activated precursors are also disclosed. Aluminum laminated surfaces and methods of circuit formation therefrom are further disclosed. Circuits formed on an aluminum heat sink are also disclosed. The inventive subject matter further discloses methods of electrolytic plating by controlling surface area of an anode.

Glass wiring board
11516907 · 2022-11-29 · ·

A glass wiring board that can be kept from cracking by better preventing concentration of stresses in a glass plate on which a conductor layer including an electrolytic copper plating layer is provided, the wiring board includes: a glass plate; a first metal layer covering at least a part of the glass plate; and a second metal layer covering at least a part of the first metal layer, and the area of the first metal layer in contact with the second metal layer is smaller than the area of the second metal layer facing the first metal layer.

Method for coating steel sheets or steel strips and method for producing press-hardened components therefrom

The invention relates to a method for coating a steel sheet or steel strip to which an aluminium-based coating is applied in a dip-coating process and the surface of the coating is freed of a naturally occurring aluminium oxide layer. In order to provide a low-cost method for coating steel sheets or steel strips that makes the steel sheets or steel strips outstandingly suitable for the production of components by means of press hardening and for the further processing thereof, it is proposed that transition metals or transition metal compounds are subsequently deposited on the freed surface of the coating to form a top layer. The invention also relates to a method for producing press-hardened components from the aforementioned steel sheets or steel strips with an aluminium-based coating.

OPTICAL FILMS AND METHODS OF MANUFACTURING SUCH OPTICAL FILMS

A method of manufacturing an optical film includes providing a base film. The base film includes a substrate defining a first surface and a second surface. The base film also includes a plurality of structures defining an upper surface and at least one side surface extending from the corresponding upper surface to a base portion. The method also includes depositing a catalyst material on each of the plurality of structures and the base portion to form a catalyst layer thereon. The method further includes selectively removing the catalyst layer from the upper surface of each of the plurality of structures and the base portion while retaining an activity of the catalyst layer on the at least one side surface of each of the plurality of structures. The method includes forming a metallic layer on the at least one side surface of each of the plurality of structures.