In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO.sub.x) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.

An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming an electrical device on a first substrate, depositing a passivation layer on the electrical device, printing a palladium-containing ink on exposed aluminum pads in or on the electrical device, converting the palladium-containing ink to a palladium-containing layer, and forming a conductive pad or bump on the palladium-containing layer. The passivation layer exposes the aluminum pads.

A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.

Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 m in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30 C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.

Electrically-conductive sintered, substantially round and spherical particles and methods for producing such electrically-conductive sintered, substantially round and spherical particles from an alumina-containing raw material. Methods for using such electrically-conductive sintered, substantially round and spherical particles in hydraulic fracturing operations.

A method of producing a film-attached resin base may include supplying a surface treatment gas including at least fluorine gas to a resin base including reinforcing fibers so that embrittled regions are formed in a surface of the resin base and the reinforcing fiber present near the surface of the resin base is modified at least partially; removing at least the embrittled regions so that an uneven surface is formed on the resin base and the reinforcing fiber is at least partially exposed in the uneven surface; and forming a film onto the uneven surface of the resin base.

In some embodiments, the effect of uniformly dispersing carbon nanotubes in the material is achieved by including Ag in the carbon nanotubes to suppress the aggregation of carbon nanotubes when the electrical contacts are prepared.

A method for metalizing a polymer substrate and a polymer article prepared thereof. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120. The surface of the polymer substrate is then subjected to chemical plating.

Electrically-conductive sintered, substantially round and spherical particles and methods for producing such electrically-conductive sintered, substantially round and spherical particles from an alumina-containing raw material. Methods for using such electrically-conductive sintered, substantially round and spherical particles in hydraulic fracturing operations.

A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120. The surface of the polymer substrate is then subjected to chemical plating.