Provided is a metal matrix nanocomposite comprising: (a) a metal or metal alloy as a matrix material; and (b) multiple graphene sheets that are dispersed in said matrix material, wherein said multiple graphene sheets are substantially aligned to be parallel to one another and are in an amount from 0.1% to 95% by volume based on the total nanocomposite volume; wherein the multiple graphene sheets contain single-layer or few-layer graphene sheets selected from pristine graphene, graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof and wherein the chemically functionalized graphene is not graphene oxide. The metal matrix exhibits a combination of exceptional tensile strength, modulus, thermal conductivity, and/or electrical conductivity.

A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

A method for fabrication of selectively deposited electroless copper metallization on a photo-definable glass substrate. The electroless copper can metallize a two-dimensional or three-dimensional structure on the photo-definable glass to connect or isolate passive or active devices. The electroless copper metallization can also coat the side walls of aspect ratio blind or through hole via.

The present invention pertains to an insulation system comprising one or more insulation blankets, wherein each of said multilayer insulation blankets comprises: a core consisting of an insulation material [material (I)], and a shell encapsulating said core, said shell comprising at least one multilayer assembly comprising: (1) an outer layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of, at least one thermoplastic polymer [polymer (1)] having a limiting oxygen index (LOI) of at least 20% by volume, wherein at least one surface, preferably the inner surface, of said layer (L1) comprises one or more grafted functional groups [surface (L1-f)], (2) directly adhered to said at least one surface (L1-f), a layer consisting of at least one metal compound (M1) [layer (L2)], and (3) optionally, directly adhered to the opposite side of the layer (L2), a layer consisting of at least one metal compound (M2) [layer (L3)], said metal compound (M2) being equal to or different from said metal compound (M1). The present invention also pertains to a process for the manufacture of said insulation system and to uses of said insulation system in various applications including aircraft applications.

A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

The present invention pertains to an insulation system comprising one or more insulation blankets, wherein each of said multilayer insulation blankets comprises: a core consisting of an insulation material [material (I)], and a shell encapsulating said core, said shell comprising at least one multilayer assembly comprising: (1) an outer layer [layer (L1)] consisting of a composition [composition (C1)] comprising, preferably consisting of at least one thermoplastic polymer [polymer (1)] having a limiting oxygen index (LOI) of at least 20% by volume, wherein at least one surface, preferably the inner surface, of said layer (L1) comprises one or more grafted functional groups [surface (L1-f)], (2) directly adhered to said at least one surface (L1-f), a layer consisting of at least one metal compound (M1) [layer (L2)], and (3) optionally, directly adhered to the opposite side of the layer (L2), a layer consisting of at least one metal compound (M2) [layer (L3)], said metal compound (M2) being equal to or different from said metal compound (M1). The present invention also pertains to a process for the manufacture of said insulation system and to uses of said insulation system in various applications including aircraft applications.

Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.

A substrate processing apparatus includes a substrate holder, a rotational driving unit, a cover body, a transfer mechanism, a cleaning liquid supply and a controller. The substrate holder is configured to hold a substrate. The rotational driving unit is configured to rotate the substrate holder. The cover body is configured to cover a top surface of the substrate held by the substrate holder. The transfer mechanism is configured to transfer a cleaning jig to the substrate holder. The cleaning liquid supply is configured to supply a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder. The controller is configured to control the rotational driving unit to rotate the substrate holder. The cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.