Patent classifications
C23C18/1875
Structure with Conductive Pattern and Method for Manufacturing Same
Provided are: a structure with a conductive pattern that can be obtained in a simple manufacturing process and that exhibits favorable interlayer adhesion; and a method for manufacturing same. An embodiment of the present invention provides a structure with a conductive pattern, the structure comprising a base material, and a copper-containing conductive layer arranged on the surface of the base material, wherein when a principal surface of the conductive layer on the side facing the base material is a first principal surface, and a principal surface of the conductive layer on the opposite side from the first principal surface is a second principal surface, the conductive layer: has a porosity of 0.01 to 50 volume percent in a first principal surface-side region that extends from the first principal surface to a depth of 100 nm in the thickness direction of the conductive layer.
SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAME
A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
ELECTRODE-FORMING COMPOSITION
The present invention pertains to an electrode-forming composition comprising: (a) at least one fluoropolymer [polymer (F)]; (b) particles of at least one active electrode material [particles (P)], said particles (P) comprising: —a core comprising at least one active electrode compound [compound (NMC)] of formula (I): Li[Li.sub.x(A.sub.pB.sub.QC.sub.w).sub.1-x]O.sub.2 (I) wherein A, B and C, different from each other, are selected from the group consisting of Fe, Ni, Mn and Co, x is comprised between 0 and 0.3, P is comprised between 0.2 and 0.8, preferably between 0.2 and 0.5, more preferably between 0.2 and 0.4, Q is comprised between 0.1 and 0.4, and W is comprised between 0.1 and 0.4, and —an outer layer consisting of a metal compound [compound (M)] different from Lithium, said outer layer at least partially surrounding said core; and (c) a liquid medium [medium (L)]. The present invention also pertains to a process for manufacturing said electrode-forming composition, to the use of said electrode-forming composition in a process for manufacturing a positive electrode and to the positive electrode obtainable therefrom.
Sealing article comprising metal coating, method of making and method of using the same
A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
METHOD
The present invention relates to methods of immobilising metals on polymeric surfaces using surfactants and to products that can be formed by such methods. Polymer substrates with metal immobilised on the surface are very useful in a variety of applications. The metal is usually in the form of a nanoparticle. A major use of the invention is in catalysts. The invention can also be used in medical applications, such as to make antimicrobial surfaces.
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM
In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnO.sub.x) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.
SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAME
A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
Sealing article comprising metal coating, method of making and method of using the same
A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
A substrate processing apparatus includes a substrate holder, a rotational driving unit, a cover body, a transfer mechanism, a cleaning liquid supply and a controller. The substrate holder is configured to hold a substrate. The rotational driving unit is configured to rotate the substrate holder. The cover body is configured to cover a top surface of the substrate held by the substrate holder. The transfer mechanism is configured to transfer a cleaning jig to the substrate holder. The cleaning liquid supply is configured to supply a cleaning liquid toward a bottom surface of the cleaning jig held by the substrate holder. The controller is configured to control the rotational driving unit to rotate the substrate holder. The cleaning jig is provided with at least one hole through which the cleaning liquid discharged from the cleaning liquid supply passes toward the cover body.
Electrode-forming composition
The present invention pertains to an electrode-forming composition comprising: (a) at least one fluoropolymer [polymer (F)]; (b) particles of at least one active electrode material [particles (P)], said particles (P) comprising: a core comprising at least one active electrode compound [compound (NMC)] of formula (I):
Li[Li.sub.x(A.sub.pB.sub.QC.sub.w).sub.1-x]O.sub.2(I)
wherein A, B and C, different from each other, are selected from the group consisting of Fe, Ni, Mn and Co, x is comprised between 0 and 0.3, P is comprised between 0.2 and 0.8, preferably between 0.2 and 0.5, more preferably between 0.2 and 0.4, Q is comprised between 0.1 and 0.4, and W is comprised between 0.1 and 0.4, and an outer layer consisting of a metal compound [compound (M)] different from Lithium, said outer layer at least partially surrounding said core; and (c) a liquid medium [medium (L)]. The present invention also pertains to a process for manufacturing said electrode-forming composition, to the use of said electrode-forming composition in a process for manufacturing a positive electrode and to the positive electrode obtainable therefrom.