Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group].

The present invention relates to a method for plasma-treating a surface of a substrate, in particular a dielectric substrate, the method including the following steps: (t) wet-chemical treating the surface of the substrate with treatment solutions of a desmear process, to obtain a wet-chemical treated surface of the substrate, (i) treating a surface of the substrate with a plasma beam under atmospheric pressure, to obtain a plasma-treated surface of the substrate, (ii) activation of the plasma-treated surface of the substrate with an activation composition, to obtain an activated surface of the substrate, (iii) optionally electroless deposition of a coating metal on the activated surface of the substrate, to obtain a plating surface of the substrate, and (iv) optionally electrolytic deposition of an additional coating metal on the plating surface of the substrate obtained after optional step (iii) or on the activated surface of the substrate obtained after step (ii).

Provided are: a laminate film which is equipped with a vapor-deposited aluminum oxide film exhibiting high barrier performance and excellent so-called retort resistance, and also exhibits favorable adhesion between the vapor-deposited aluminum oxide film and a plastic substrate even after undergoing a hydrothermal treatment; a barrier laminate film containing the laminate film; and a barrier packaging material which uses the barrier laminate film. A laminate film exhibiting improved adhesion strength and barrier performance, wherein: a transition region prescribing adhesion strength is formed between the surface of the substrate film and the vapor-deposited film which primarily comprises the formed vapor-deposited aluminum oxide film, by subjecting the vapor-deposited aluminum oxide film of the laminate film to a time-of-flight secondary ion mass spectrometry (TOF-SIMS) method using a Cs (cesium) ion gun; the transition region contains elementally bonded Al.sub.2O.sub.4H, which can be modified into aluminum hydroxide which can be detected by etching using TOF-SIMS; and the rate of modification in the transition region into aluminum hydroxide, which is defined as the ratio of the modified transition region to the vapor-deposited aluminum oxide film specified by carrying out etching using TOF-SIMS, is prescribed to be 5-60%, inclusive.

The invention relates to a process for coating plastic surfaces with metals, especially plastic surfaces composed of acrylonitrile/butadiene/styrene copolymers (ABS) and composed of mixtures of these copolymers with other plastics (ABS blends), using an etch solution (composition C) comprising at least one ionic liquid IL, wherein the process comprises the treating of the plastic surface after the etching with an aqueous rinse solution RS while applying ultrasound.

The present invention addresses the problem of providing a method for manufacturing a plated composite material, the method being capable of forming a plating layer having good adhesiveness to each of a plurality of resin parts each including a different resin. The method for manufacturing a plated composite material for solving the aforementioned problem includes: a step for preparing a composite material having a heat-resistant resin part and a silicone resin part; a step for treating, with an alkaline solution, a plating region of the composite material; a step for irradiating plasma on the plating region; a step for bringing the plating region in contact with a cationic catalyst-containing liquid; and a step for performing an electroless plating treatment on the plating region. The plating region includes at least a portion of the heat-resistant resin part and at least a portion of the silicone resin part.