The amount of a processing solution used is reduced, and the quality of an electroless plated fiber material is improved. The present invention relates to a manufacturing method for an electroless plated fiber material A4. The manufacturing method includes a step S5 of electrostatically spraying a solution B containing a catalyst precursor in a state of being electrically charged to a positive potential onto a fiber material A2 while grounding the fiber material A2 and moistening the fiber material A2, and electrostatically spraying a solution C containing a reducing agent in a state of being electrically charged to a positive potential onto the fiber material A2, and a step S7 of electrostatically spraying each of a solution D containing metal ions and a solution E containing a reducing agent each in a state of being electrically charged to a positive potential onto the fiber material A3 such that the solution D containing metal ions and the solution E containing the reducing agent react with each other in the same electric field on the fiber material A3 while grounding the fiber material A3 to which a catalyst is given and moistening the fiber material A3. The present invention relates to the electroless plated fiber material A4 manufactured by the manufacturing method. The present invention relates to a manufacturing system of the electroless plated fiber material A4.

The invention provides a process for forming crack-free dielectric films on a substrate. The process comprises the application of a dielectric precursor layer of a thickness from about 0.3 μm to about 1.0 μm to a substrate. The deposition is followed by low temperature heat pretreatment, prepyrolysis, pyrolysis and crystallization step for each layer. The deposition, heat pretreatment, prepyrolysis, pyrolysis and crystallization are repeated until the dielectric film forms an overall thickness of from about 1.5 μm to about 20.0 μm and providing a final crystallization treatment to form a thick dielectric film. The process provides a thick crack-free dielectric film on a substrate, the dielectric forming a dense thick crack-free dielectric having an overall dielectric thickness of from about 1.5 μm to about 20.0 μm.

This application relates to a metal coating method for plastic outer part requiring robustness. In the metal coating method, first, provide a plastic outer part as a motion assistance tool. Thereafter, a cold plasma treatment is performed to introduce a polar functional group to a surface of the plastic outer part by treating the plastic outer part with cold plasma. Next, a metal coating layer is formed on the surface of the plastic outer part treated with the cold plasma by an electroless plating method. Thereafter, an adhesive strength improvement process of improving an adhesive strength between the metal coating layer and the plastic outer part to 1,000 g/cm.sup.2 or more by heat treatment of the plastic outer part with the metal coating layer thereon is performed.

An electrically conductive material with which excellent conduction reliability can be achieved for an oxide layer. The electrically conductive material contains electrically conductive particles including resin core particles, a plurality of electrically insulating particles being disposed on the surface of the resin core particles and forming protrusions, and an electrically conductive layer being disposed on the surface of the resin core particles and the electrically insulating particles, a Mohs' hardness of the electrically insulating particles being greater than 7. As a result, the electrically conductive particles pierce and sufficiently penetrate the oxide layer of the electrode surface so that excellent conduction reliability can be achieved.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.

A circuit substrate comprising, in the following stacked order, a resin base material 1 having a dielectric loss tangent of 0.015 or lower, a polyaniline layer 2 comprising a substituted or unsubstituted polyaniline, and a metal layer 3, wherein the metal layer 3 has a surface roughness Rz.sub.JIS of 0.5 μm or less at the surface on the side of the polyaniline layer 2.

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

A sensitizing solution, especially a sensitizing solution for sensitizing surfaces, containing a solution of tin(II) chloride SnCl.sub.2 and distilled water, especially for sensitizing non-conductive surfaces, which further contains glycerine. A method of preparation of the sensitizing solution, especially the method of preparation of the sensitizing solution, according to which the solution of tin(II) chloride SnCl.sub.2 and distilled water is mixed with a reducing agent, which is glycerine.

The present invention relates to a chrome free etch for plating on plastic processes, wherein plastic surfaces are contacted in a first etching step with an etching solution at least comprising Mn(IV)-ions and, in a second etching step, with a solution at least comprising Mn(III)- and Mn(VII)-ions prior to the metal plating step.