The present invention provides a precursor film for producing a conductive film, the precursor film including: a substrate; and a plated layer precursor layer disposed on the substrate, in which the plated layer precursor layer includes a polyfunctional monomer, a monofunctional monomer, and a polymer which has a functional group interacting with a plating catalyst or a precursor of the plating catalyst and has a polymerizable functional group.

A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 μm to 0.2 μm, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 μm and less than or equal to 0.5 μm, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.

A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.

A silver-coated resin particle having a resin particle and a silver coating layer provided on a surface of the resin particle, in which an average value of a 10% compressive elastic modulus is in a range of 500 MPa or more and 15,000 MPa or less and a variation coefficient of the 10% compressive elastic modulus is 30% or less.

To provide a semi-aromatic polyamide resin composition having excellent good plating properties, low water absorption properties, and solder reflow resistance. A semi-aromatic polyamide resin composition of the present invention comprises: 10 to 200 parts by mass of an inorganic filler (B) and 2 to 30 parts by mass of a toughness improver (C) based on 100 parts by mass of a semi-aromatic polyamide (A), wherein the semi-aromatic polyamide resin (A) satisfies the following (a) and (b): (a) a melting point (Tm) measured by differential scanning calorimetry (DSC) is 280° C. or higher; and (b) an equilibrium water absorption rate at 80° C. and 95% RH is 3.5% or less.

A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.

A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

A method of coating an antimicrobial conductive metal layer on a non-conductive surface of articles with novel chemistry and methods with just a few process steps consisting of contacting the chemistries at room temperature for short durations is disclosed. The methodology is environmentally friendly, non-toxic aqueous bath of different salt compositions for providing uniform anti-microbial metal coating on the articles. The cost-effective methodology can be used on a wide variety of non-conductive surfaces such as glass, fibers, textiles, ceramic, plastic, foam and so on.

An antimicrobial device can include a common touch surface of a non-metallic material, and an antimicrobial metal layer applied to the common touch surface at an average thickness ranging from a single metal atom in thickness to 1 mm.

The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably.

In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.