Patent classifications
C23C18/38
Method and apparatus for mass production of AR diffractive waveguides
A method and apparatus for mass production of AR diffractive waveguides. Low-cost mass production of large-area AR diffractive waveguides (slanted surface-relief gratings) of any shape. Uses two-photon polymerization micro-nano 3D printing to realize manufacturing of slanted grating large-area masters of any shape (thereby solving the problem about manufacturing of slanted grating masters of any shape on the one hand, realizing direct manufacturing of large-size wafer-level masters on the other hand, and also having the advantages of low manufacturing cost and high production efficiency). Composite nanoimprint lithography technology is employed (in combination with the peculiar imprint technique and the composite soft mold suitable for slanted gratings) to solve the problem that a large-slanting-angle large-slot-depth slanted grating cannot be demolded and thus cannot be manufactured, and realize the manufacturing of the slanted grating without constraints (geometric shape and size).
CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD
A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.
CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD
A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.
METALLIC COATED SUBSTRATES
The invention relates to metallic substrates surface coated with a coating layer comprising a metal and an additive.
DISSIMILAR METAL WELDED BODY AND METHOD OF MANUFACTURING THE SAME
Provided are a dissimilar metal welded body and a method of manufacturing the same, capable of preventing galvanic corrosion in a connection portion between dissimilar metals in the dissimilar metal welded body and of sufficient insulation coating being applied even when the insulation coating is applied to the dissimilar metal welded body. The dissimilar metal welded body includes a first member made of a metal containing aluminum as a main component, a second member made of a metal containing copper as a main component, a welded portion formed by pressure-welding an end face of the first member and an end face of the second member to each other, and a metal film that continuously covers a substantially entire part of the first member and at least a part of the second member. The metal film is a film made of a metal containing copper as a main component.
Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom
A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.
Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom
A thermoset resin for forming parts to be metal plated includes a vat photopolymerization (VPP) thermoset resin and an etchable phase disposed in the VPP thermoset resin. The etchable phase is etched from a surface of a part formed from the VPP thermoset resin such that a plurality of micro-mechanical locking sites is formed on the surface of the part. The etchable phase is at least one of organic particles, organic resins, inorganic particles, and copolymers of the VPP thermoset resin. For example, the etchable phase can be a polybutadiene phase and/or a mineral such as calcium carbonate.
PLATED SUBSTRATE
A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.
PLATED SUBSTRATE
A modified resin base material that includes a resin material having a base at a surface thereof, and a plating catalytic metal on the surface of the resin material, wherein a combination of the plating catalytic metal and the base is at least one of the following Lewis acid-base combinations according to a HSAB principle: a hard acid and a hard base or an intermediate base, an intermediate acid and a hard base, an intermediate base or a soft base, or a soft acid and an intermediate base or a soft base.
Multilayer magnetic circuit assembly
The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines an input axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet and a base layer underlying the platform layer. The outer ring overlies the base layer. An inner portion of the outer ring faces the magnet assembly and an outer portion of the outer ring is configured to couple to an outer radial portion of a proof mass assembly. The pole piece and the platform layer include a high magnetic permeability material.