A method for electroless deposition of aluminum on a substrate includes: activating the substrate; providing an aluminum ionic liquid; adding a reducing agent and an additive to the aluminum ionic liquid to form an electroless plating composition, wherein the additive may include a catalyst, an alloying element, or a combination thereof; and immersing the substrate in the electroless plating composition to have an aluminum layer deposited on the substrate. An article includes the electroless deposited aluminum layer.

A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

A method for manufacturing a main body of a faucet comprises separately molding a base body in which a valve V is installed, a first part in which a hot water passage and connecting portion are formed, a second part in which the cold water inlet and a connecting portion are formed, and a third part in which a water discharge port and connecting portion are formed, the base body and three parts being formed of a composition of ABS resin and glass fibers and combining the base body with the connecting portions of the three parts; integrating the base body and three parts into a main body of a faucet by overlaying the surfaces of the combined main body with ABS resin molten at temperate of 190° C. to 210° C. by injection molding process; and plating nickel-chromium on the exterior of the main body for protection of external molding portion.

A method for manufacturing a main body of a faucet comprises separately molding a base body in which a valve V is installed, a first part in which a hot water passage and connecting portion are formed, a second part in which the cold water inlet and a connecting portion are formed, and a third part in which a water discharge port and connecting portion are formed, the base body and three parts being formed of a composition of ABS resin and glass fibers and combining the base body with the connecting portions of the three parts; integrating the base body and three parts into a main body of a faucet by overlaying the surfaces of the combined main body with ABS resin molten at temperate of 190° C. to 210° C. by injection molding process; and plating nickel-chromium on the exterior of the main body for protection of external molding portion.

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications.

There is provided with a method for manufacturing a resin product. One embodiment includes performing a modification process on a portion of a surface of the resin product not less than two times by different methods to modify the portion such that a plating metal can be deposited on the portion.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

A method of producing a hot-dip Zn alloy-plated steel sheet includes: dipping a base steel sheet in a hot-dip Zn alloy plating bath to form a hot-dip Zn alloy plating layer on a surface of the base steel sheet; and contacting an aqueous solution containing a water-soluble corrosion inhibitor with a surface of the hot-dip Zn alloy plating layer to cool the base steel sheet and the hot-dip Zn alloy plating layer having a raised temperature through formation of the hot-dip Zn alloy plating layer. A temperature of the surface of the hot-dip Zn alloy plating layer when the aqueous solution is to be contacted with the surface of the hot-dip Zn alloy plating layer is equal to or more than 100° C. and equal to or less than a solidifying point of the plating layer. The aqueous solution containing the water-soluble corrosion inhibitor satisfies the Equation [{(Z.sub.0−Z.sub.1)/Z.sub.0}100≧201.

A method of producing a hot-dip Zn alloy-plated steel sheet includes: dipping a base steel sheet in a hot-dip Zn alloy plating bath to form a hot-dip Zn alloy plating layer on a surface of the base steel sheet; and contacting an aqueous solution containing a water-soluble corrosion inhibitor with a surface of the hot-dip Zn alloy plating layer to cool the base steel sheet and the hot-dip Zn alloy plating layer having a raised temperature through formation of the hot-dip Zn alloy plating layer. A temperature of the surface of the hot-dip Zn alloy plating layer when the aqueous solution is to be contacted with the surface of the hot-dip Zn alloy plating layer is equal to or more than 100° C. and equal to or less than a solidifying point of the plating layer. The aqueous solution containing the water-soluble corrosion inhibitor satisfies the Equation [{(Z.sub.0−Z.sub.1)/Z.sub.0}100≧201.