An electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process including an electroless plating process for forming a nickel plating film and a gold plating film in this order on a surface of a copper material by a electroless plating method. The electroless plating process includes a step of forming a nickel plating film containing boron by a reductive electroless nickel strike plating method, and a step of forming a gold plating film by a reductive electroless gold plating method. The two-layer plating film according to the present disclosure is formed by this process.

An electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process including an electroless plating process for forming a nickel plating film and a gold plating film in this order on a surface of a copper material by a electroless plating method. The electroless plating process includes a step of forming a nickel plating film containing boron by a reductive electroless nickel strike plating method, and a step of forming a gold plating film by a reductive electroless gold plating method. The two-layer plating film according to the present disclosure is formed by this process.

The present invention provides a conductive fabric comprising base cloth and a conductive metallic circuit structure formed on the surface of the base cloth. The conductive metallic circuit structure comprises at least one metallic seed layer and at least one chemical-plating layer. The metallic seed layer is an evaporation-deposition layer or a sputter-deposition layer and has a circuit pattern. The chemical-plating layer is applied over the surface of the metallic seed layer. The conductive fabric has improved conductivity and heat generation efficiency.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.

An antimicrobial device can include a common touch surface of a non-metallic material, and an antimicrobial metal layer applied to the common touch surface at an average thickness ranging from a single metal atom in thickness to 1 mm.

A method of manufacturing a bright surface product comprises a step of performing electroless plating to form a first metal film on a base coat layer formed on a substrate, a step of performing electrolytic plating to form a second metal film thereon so that the bonding strength between each film of a multi-layered metal film comprising the first metal film and the second film is higher than the bonding strength between the base coat layer and the first metal layer, a step of integrally and discontinuously segmentalizing the multi-layered metal film with cracks to form an island-like metal film comprising a collection of fine multi-layered metal regions with island-like structures; and a step of forming a translucent top coat layer to cover the fine multi-layered metal regions of the island-like metal film and enter into the cracks to make contact with the base coat layer.

Additive manufacturing processes, such as fused filament fabrication, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of a printed object. Conductive traces and similar features may be introduced in conjunction with fused filament fabrication processes by incorporating a metal precursor in a polymer filament having a filament body comprising a thermoplastic polymer, and forming a printed object from the polymer filament through layer-by-layer deposition, in which the metal precursor remains substantially unconverted to metal while forming the printed object. Suitable polymer filaments compatible with fused filament fabrication may comprise a thermoplastic polymer defining a filament body, and a metal precursor contacting the filament body, in which the metal precursor is activatable to form metal islands upon laser irradiation.

A chemical conversion-treated steel pipe has a chemical conversion treatment film on a plated layer on a steel sheet. The plated layer is configured from a zinc alloy comprising 0.05-60 mass % aluminum and 0.1-10.0 mass % magnesium. The chemical conversion treatment film contains a fluorine resin, a base resin, metal flakes and a chemical conversion treatment component. The base resin is one or more selected from a group consisting of polyurethane, polyester, acrylic resins, epoxy resins and polyolefin. The content of fluorine resin with respect to the total amount of fluorine resin and base resin is at least 3.0 mass % calculated as fluorine atoms. The content of the base resin with respect to 100 parts by mass of the fluorine resin is at least 10 parts by mass. The content of metal flakes in the chemical conversion treatment film is greater than 20 mass % up to and including 60 mass %.

A chemical conversion-treated steel pipe has a chemical conversion treatment film on a plated layer on a steel sheet. The plated layer is configured from a zinc alloy comprising 0.05-60 mass % aluminum and 0.1-10.0 mass % magnesium. The chemical conversion treatment film contains a fluorine resin, a base resin, metal flakes and a chemical conversion treatment component. The base resin is one or more selected from a group consisting of polyurethane, polyester, acrylic resins, epoxy resins and polyolefin. The content of fluorine resin with respect to the total amount of fluorine resin and base resin is at least 3.0 mass % calculated as fluorine atoms. The content of the base resin with respect to 100 parts by mass of the fluorine resin is at least 10 parts by mass. The content of metal flakes in the chemical conversion treatment film is greater than 20 mass % up to and including 60 mass %.

There is provided a method for producing a metal-plated stainless material, the method including performing an acid treatment of treating a stainless steel material with an acidic solution; performing an etching of treating the stainless steel material after the acid treatment with an etching treatment agent; and a modifying the surface of the stainless steel material after the etching into a state suitable for a metal plating process.