A piston has a piston main body including an aluminum alloy, and a covering layer formed on the outer surface of the piston main body, and the covering layer has a first plating layer including an iron-phosphorous alloy, and a second plating layer including a nickel-phosphorous alloy formed on the first plating layer.

A piston has a piston main body including an aluminum alloy, and a covering layer formed on the outer surface of the piston main body, and the covering layer has a first plating layer including an iron-phosphorous alloy, and a second plating layer including a nickel-phosphorous alloy formed on the first plating layer.

A graphene reinforced aluminum matrix composite with high electrical conductivity and a preparation method thereof. The method includes: obtaining aluminum coated graphene powder by plating aluminum on a graphene surface, melting aluminum block into aluminum liquid, heating a mold to be lower than an aluminum melting point, alternately pouring the aluminum liquid and the aluminum coated graphene powder into the mold for layered casting to obtain a sandwich structure; extruding the sandwich structure into a rectangular test block and then heating to 500˜600° C., performing heat preservation for a preset time and performing forging treatment, and performing longitudinal cold deformation under inert gas to obtain the graphene reinforced aluminum matrix composite. The method can solve a problem that poor wettability of graphene and aluminum matrix, the graphene is evenly dispersed in the aluminum matrix, which can improve strength of the aluminum matrix and keep its high electrical conductivity.

An antimicrobial device can include a common touch surface of a non-metallic material, and an antimicrobial metal layer applied to the common touch surface at an average thickness ranging from a single metal atom in thickness to 1 mm.

The problem of the present invention is to provide a plating stack (a stack of plating films) for applying on surface of conductor circuits or the like, the plating stack can maintain high bond strength when solder is bonded on that and can be produced stably.

In the method for producing a plating stack of the present invention, a plating layer A mainly composed of a second metal is deposited on an object to be plated S mainly composed of a first metal by a substitution reaction, then a plating layer B mainly composed of palladium is deposited on the plating layer A, and then a plating layer C mainly composed of nickel is deposited on the plating layer B by a redox reaction. The first metal is, for example, copper. The second metal is, for example, gold, platinum or silver.

The amount of a processing solution used is reduced, and the quality of an electroless plated fiber material is improved. The present invention relates to a manufacturing method for an electroless plated fiber material A4. The manufacturing method includes a step S5 of electrostatically spraying a solution B containing a catalyst precursor in a state of being electrically charged to a positive potential onto a fiber material A2 while grounding the fiber material A2 and moistening the fiber material A2, and electrostatically spraying a solution C containing a reducing agent in a state of being electrically charged to a positive potential onto the fiber material A2, and a step S7 of electrostatically spraying each of a solution D containing metal ions and a solution E containing a reducing agent each in a state of being electrically charged to a positive potential onto the fiber material A3 such that the solution D containing metal ions and the solution E containing the reducing agent react with each other in the same electric field on the fiber material A3 while grounding the fiber material A3 to which a catalyst is given and moistening the fiber material A3. The present invention relates to the electroless plated fiber material A4 manufactured by the manufacturing method. The present invention relates to a manufacturing system of the electroless plated fiber material A4.

The amount of a processing solution used is reduced, and the quality of an electroless plated fiber material is improved. The present invention relates to a manufacturing method for an electroless plated fiber material A4. The manufacturing method includes a step S5 of electrostatically spraying a solution B containing a catalyst precursor in a state of being electrically charged to a positive potential onto a fiber material A2 while grounding the fiber material A2 and moistening the fiber material A2, and electrostatically spraying a solution C containing a reducing agent in a state of being electrically charged to a positive potential onto the fiber material A2, and a step S7 of electrostatically spraying each of a solution D containing metal ions and a solution E containing a reducing agent each in a state of being electrically charged to a positive potential onto the fiber material A3 such that the solution D containing metal ions and the solution E containing the reducing agent react with each other in the same electric field on the fiber material A3 while grounding the fiber material A3 to which a catalyst is given and moistening the fiber material A3. The present invention relates to the electroless plated fiber material A4 manufactured by the manufacturing method. The present invention relates to a manufacturing system of the electroless plated fiber material A4.

A wiring board includes a substrate having main surfaces and an electrode containing Cu or Ag as a main component on at least one main surface of the substrate, wherein the electrode protrudes from the substrate, a surface of the electrode is covered by a first Ni film containing crystalline Ni as a main component, a surface of the first Ni film is covered by a second Ni film containing amorphous Ni as a main component, and the first Ni film covers a part of a first corner where a side surface of the electrode is in contact with the substrate.

Various embodiments relate to methods, apparatus, and systems for forming an interconnect structure, or a portion thereof. The method may include contacting the substrate with a functionalization bath comprising a first solvent and a functionalization reactant to form a modified first material, and then depositing a second material on the modified first material through electroless plating, electroplating, chemical vapor deposition, or atomic layer deposition. The first material may be a dielectric material, a barrier layer, or a liner, and the second material may be a barrier layer or a barrier layer precursor, a liner, a seed layer, or a conductive metal that forms the interconnect of the interconnect structure, according to various embodiments.

Metal coated resin particles include: spherical core resin particles; and a metal coated layer provided on a surface of each of the core resin particles, in which the metal coated layer consists of: a first silver layer formed on the surface of each of the core resin particles; a tin intermediate layer consisting of one or more of metallic tin and/or tin compounds selected from the group consisting of tin (Sn), tin oxide (Sn.sub.xO.sub.y), and tin hydroxide (Sn.sub.x(OH).sub.y) formed on a surface of the first silver layer (where, 0.1<x<4, 0.1<y<5); and a second silver layer formed on a surface of the tin intermediate layer.