An electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process including an electroless plating process for forming a nickel plating film and a gold plating film in this order on a surface of a copper material by a electroless plating method. The electroless plating process includes a step of forming a nickel plating film containing boron by a reductive electroless nickel strike plating method, and a step of forming a gold plating film by a reductive electroless gold plating method. The two-layer plating film according to the present disclosure is formed by this process.

A method that forms a metal plating film having a thick film thickness by a solid phase method is provided. The present disclosure is a method that forms the metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal. The method includes: depositing the second metal on a surface of a copper base material to form the plating film of the second metal; and depositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal. The solid electroless plating method in the depositing of the first metal is performed using a laminated complex. The laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material, a third metal, a second substitution-type electroless plating bath, and an insulating polymer. The first substitution-type electroless plating bath contains ions of the first metal. The second metal is plated on the copper base material. The third metal has an ionization tendency larger than the ionization tendency of the first metal. The second substitution-type electroless plating bath contains ions of the first metal.

A method that forms a metal plating film having a thick film thickness by a solid phase method is provided. The present disclosure is a method that forms the metal plating films of a first metal and a second metal having an ionization tendency larger than an ionization tendency of the first metal. The method includes: depositing the second metal on a surface of a copper base material to form the plating film of the second metal; and depositing the first metal on a surface of the second metal by a solid electroless plating method to form the plating film of the first metal. The solid electroless plating method in the depositing of the first metal is performed using a laminated complex. The laminated complex includes a first substitution-type electroless plating bath, a solid electrolyte membrane, a copper base material, a third metal, a second substitution-type electroless plating bath, and an insulating polymer. The first substitution-type electroless plating bath contains ions of the first metal. The second metal is plated on the copper base material. The third metal has an ionization tendency larger than the ionization tendency of the first metal. The second substitution-type electroless plating bath contains ions of the first metal.

Provided is a method for producing a composite alloy for use in an electrode for an alkaline storage battery, including a powder preparation step of preparing a hydrogen storage alloy powder containing Ti and Cr and having a BCC structure, an etching step of applying an acid to the hydrogen storage alloy powder prepared in the powder preparation step, a Pd film forming step of coating the surface of the hydrogen storage alloy powder subjected to the etching step with Pd using a substitution plating method, and a heat treatment step of heating the hydrogen storage alloy powder having a Pd film formed, at said heating being a temperature of 500° C. or less, wherein in the Pd coating forming step, the hydrogen storage alloy powder is coated with Pd under the condition that the Pd element weight ratio of the composite alloy to be produced is 0.47% or more.

According to various embodiments of the present disclosure, an electronic device may comprise a housing including a front plate and a rear plate and a display. At least one of the front plate or the rear plate may include a plate exposed to an outside. The plate may include a metal member including a first metal and an oxide layer formed on at least one surface of the metal member. The metal member may comprise a first portion including irregularities formed by at least one second metal included in a first solution, the at least one second metal being substituted for the a portion of the metal member, the at least one second metal being removed from the metal member by the first solution and a flat second portion etched by the first solution.

The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

The disclosed process is capable of depositing thin layers of a wide variety of metals onto powders of magnesium, aluminum, and their alloys. A material is provided that comprises particles containing a reactive metal coated with a noble metal that has a less-negative standard reduction potential than the reactive metal. The coating has a thickness from 1 nanometer to 100 microns, for example. A method of forming an immersion deposit on a reactive metal comprises: combining a reactive metal, an ionic liquid, and a noble metal salt; depositing the noble metal on the reactive metal by a surface-displacement reaction, thereby generating the immersion deposit on the reactive metal; and removing the ionic liquid from the immersion deposit. The material may be present in an article or object (e.g., a sintered part) containing from 0.25 wt % to 100 wt % of a coated reactive metal as disclosed herein.

A bonding structure formed on a substrate includes an indium layer and a passivating nickel plating formed on the indium layer. The nickel plating serves to prevent a reaction involving the indium layer.

A method is provided for fabricating a terminal electrode. The terminal electrode is applied on a multilayer ceramic capacitor (MLCC). The method prints inner electrodes on full area together with protective layers. The MLCC uses the thickness of thinned dielectric ceramic layers and the stacking of nickel inner-electrode layers. High capacitance is achieved at ends and sides with high electrode-to-ceramic ratios. Thus, the present invention uses a coating technology of ultra-low-temperature electrochemical deposition to fabricate low internal-stress MLCC terminal electrodes together with insulating protective layers for improving MLCC yield while cost reduced.

An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.