A method for applying a metallic protective coating to a surface of a steel product, where another surface is to remain free from the metallic protective coating, may involve applying the metallic protective coating by hot dip coating in a hot dip coating bath. A preliminary coating may be applied to the surface that is to remain free from the metallic protective coating prior to the hot dip coating. The preliminary coating may include SiO.sub.2 and may prevent the metallic protective coating from adhering to the intended surface during hot dip coating. Thus one surface of a steel product may be provided with a metallic protective coating, and another surface of the steel product may be kept free from the protective coating, all with a minimum of cost and complexity and with optimized resource economics. Further, the preliminary coating, deposited from a gas phase to that surface of the steel product that is to be kept free from the metallic protective coating, may be a layer that includes amorphous silicon dioxide and has a layer thickness of 0.5-500 nm.”

A method for producing a pressing tool for producing a workpiece, the pressing tool may include a pressing surface having a structure of protrusions and recesses, the method may include applying a mask for covering regions, applying a metal layer to the regions not covered by the mask while adding mineral particles, and/or repeating the foregoing steps until the pressing surface with the structure of the protrusions and recesses is formed by repeated, layered application of masks and metal layers while adding mineral particles. The pressing surface may have regions of different degrees of gloss and/or metal of at least two metal layers may be different in order to obtain the regions of different degrees of gloss.

A process for making a workpiece, e.g., such as a utility or communications monopole can include selectively masking welded regions (e.g., joining the pole to a collar or other portion of a base, or joining component parts of the pole) before a corrosion-inhibiting galvanizing process that can include precleaning (e.g., in a hot acid bath) and a hot zinc galvanizing bath. The masking material can than optionally be removed, such as abrasively. The unmasked regions can optionally be spot-treated, if desired, such as to inhibit corrosion.

A masking device for masking an opening of a workpiece including a first end, a second end opposite the first end, a longitudinal axis that extends between the first end and the second end, and a cylindrical body extending between the first end and the second end. The cylindrical body has an outer periphery defining the circumferential outermost extent of the cylindrical body. The masking device further includes an aperture extending through the cylindrical body between the first end and the second end. The aperture has an inner periphery defining the circumferential innermost extent of the cylindrical body. The masking device further includes a tab extending away from the first end of cylindrical body along a direction parallel to the longitudinal axis.

A hot-dip plated steel sheet includes a hot-dip plated layer formed on a surface of a steel sheet, the hot-dip plated layer contains 4 to 22 mass % of Al and 1.0 to 10 mass % of Mg with a remainder including Zn and impurities, a pattern portion and a non-pattern portion are formed in the hot-dip plated layer, an element concentrated region containing an element M and an interface alloy layer containing Fe and Al are present at an interface between the steel sheet and the hot-dip plated layer in the pattern portion, an average concentration of the element M contained in the hot-dip plated layer present in the pattern portion and the element concentrated region is 0.0010 to 2 mass %, and in the element concentrated region, the element M is concentrated two or more times the hot-dip plated layer present in the pattern portion, or the element M is unevenly distributed.

A hot-dip plated steel sheet includes a hot-dip plated layer formed on a surface of a steel sheet, the hot-dip plated layer contains 4 to 22 mass % of Al and 1.0 to 10 mass % of Mg with a remainder including Zn and impurities. A pattern portion and a non-pattern portion are formed in the hot-dip plated layer. An element concentrated region containing an element M and an interface alloy layer containing Fe and Al are present at an interface between the steel sheet and the hot-dip plated layer in the pattern portion. An average concentration of the element M contained in the hot-dip plated layer present in the pattern portion and the element concentrated region is 0.0010 to 2 mass %. In the element concentrated region, the element M is concentrated two or more times the hot-dip plated layer present in the pattern portion, or the element M is unevenly distributed.

A film forming method includes, sequentially performing: preparing a substrate having a first metal film and a first insulating film formed in different regions of a surface of the substrate; forming a first self-assembled monolayer on a surface of the first metal film selectively with respect to a surface of the first insulating film; forming a first bonding film on both the surface of the first insulating film and a surface of the first self-assembled monolayer using a first molecular bonding agent; removing the first self-assembled monolayer to remove a portion of the first bonding film in contact with the surface of the first self-assembled monolayer; and forming a second metal film on the surface of a remaining portion of the first bonding film and the surface of the first metal film.

A hot-dip coating system comprising a substrate pathway comprising one or more rollers configured to move a substrate along the substrate pathway between a first end and a second end, a pre-coating section arranged with respect to the substrate pathway and configured to apply a first coating to the substrate, a pre-heating section arranged with respect to the substrate pathway and configured to heat the substrate and the first coating, and a hot-dip coating section arranged with respect to the substrate pathway and configured to apply a second coating to the substrate.