An apparatus for the continuous hot dip coating of a metal strip is provided. The apparatus includes a vessel intended to contain a liquid metal bath, a bottom roller and a displacement casing for the metal strip. The casing includes an upper portion and a lower portion. The lower portion includes a pouring box delimiting at least two liquid metal pouring compartments. Each pouring compartment is inwardly delimited by an inner wall including an upper rim. The casing is provided with the pouring box, is rotatable relative to the metal strip around a first rotation axis and the pouring box is rotatable relative to the upper portion of the casing around a second rotation axis. A method for coating the metal sheet is also provided.

An installation for producing batteries is disclosed, having a lead bath station with two heatable and mobile lead bath carriages arranged in an assignable manner at the stationary lead melting pot. Both carriages having a pumping-sucking device that serves for the changing of the lead bath. Molten lead is pumped out of the lead pot into an empty carriage. Both the pumping-sucking devices are arranged pivotably about the axis of rotation (B) and the pivot pin that is fixedly arranged on the carriage is arranged such that it can be separately pivoted about the axis of rotation (A), thus, making it possible for the suction tube and a discharge tube to be moved between the carriage and the led pot.

An installation for producing batteries is disclosed, having a lead bath station with two heatable and mobile lead bath carriages arranged in an assignable manner at the stationary lead melting pot. Both carriages having a pumping-sucking device that serves for the changing of the lead bath. Molten lead is pumped out of the lead pot into an empty carriage. Both the pumping-sucking devices are arranged pivotably about the axis of rotation (B) and the pivot pin that is fixedly arranged on the carriage is arranged such that it can be separately pivoted about the axis of rotation (A), thus, making it possible for the suction tube and a discharge tube to be moved between the carriage and the led pot.

An apparatus for the continuous hot dip coating of a metal strip is provided. The apparatus includes a vessel intended to contain a liquid metal bath, a bottom roller and a displacement casing for the metal strip. The casing includes an upper portion and a lower portion. The lower portion includes a pouring box delimiting at least two liquid metal pouring compartments. Each pouring compartment is inwardly delimited by an inner wall including an upper rim. The casing is provided with the pouring box, is rotatable relative to the metal strip around a first rotation axis and the pouring box is rotatable relative to the upper portion of the casing around a second rotation axis. A method for coating the metal sheet is also provided.

The present invention relates to a superconductor and a method of manufacturing the same. The superconductor comprises: a substrate having a tape shape that extends in a first direction and having surfaces which are defined as a top surface, a bottom surface, and both side surfaces; a superconductive layer positioned on the top surface of the substrate; a first stabilizing layer disposed on the superconductive layer and containing a first metal; a protective layer disposed on the first stabilizing layer and containing a second metal which is different from the first metal; and an first alloy layer disposed between the stabilizing layer and the protective layer and containing the first and second metals.

The present invention relates to a superconductor and a method of manufacturing the same. The superconductor comprises: a substrate having a tape shape that extends in a first direction and having surfaces which are defined as a top surface, a bottom surface, and both side surfaces; a superconductive layer positioned on the top surface of the substrate; a first stabilizing layer disposed on the superconductive layer and containing a first metal; a protective layer disposed on the first stabilizing layer and containing a second metal which is different from the first metal; and an first alloy layer disposed between the stabilizing layer and the protective layer and containing the first and second metals.

A method for coating a web with a metal layer includes heating a metal in a container to create molten metal. The metal is selected from a group consisting of lithium (Li), sodium (Na), potassium (K), indium (In), tin (Sn), cadmium (Cd), zinc (Zn), and lead (Pb). The method includes coating at least one surface of a web with a metal layer using the molten metal. The web is made of a material selected from a group consisting of copper (Cu), nickel (Ni), titanium (Ti), stainless steel, polymer, and carbon.

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few m.

A hot-dip plating apparatus for plating a thin molten solder film can control a film thickness of a molten solder on a base material evenly and in increments of a few m and achieve a thin-film solder plating having a film thickness less than a conventional system. As shown in FIG. 1, this apparatus comprises a solder bath 17 of accommodating the molten solder 7; a second conveying section 23 for drawing up a strip member 31 from the solder bath; and a blower section 19 for blowing hot gas on the strip member 31 immediately after being drawn up from the solder bath by a second conveying section 23; the hot gas having a predetermined flow volume and a predetermined temperature equal to or higher than a melting temperature of the molten solder 7. According to this configuration, the excess molten solder 7 can be trimmed from the strip member 31 corresponding to composition of the molten solder 7. Thus, the film thickness of the molten solder 7 coated on the strip member 31 can be controlled evenly and in increments of a few m.

It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.