Provided is an electrically insulated component for use in a planar transformer. The insulated component may include a planar transformer conductive component having a first surface, a second surface and a plurality of edges. The insulated component may also include a first layer including an oxidized metal coating, as well as a second layer including an electrophoretically deposited (EPD) insulating coating. The EDP coating may include a polymer and an inorganic material. The first layer and the second layer may cover at least the first surface and the plurality of edges of the conductive component and the first layer may be disposed between the conductive component and the second layer. Also provided is a method of manufacturing of the electrically insulated component.

Provided is an electrically insulated component for use in a planar transformer. The insulated component may include a planar transformer conductive component having a first surface, a second surface and a plurality of edges. The insulated component may also include a first layer including an oxidized metal coating, as well as a second layer including an electrophoretically deposited (EPD) insulating coating. The EDP coating may include a polymer and an inorganic material. The first layer and the second layer may cover at least the first surface and the plurality of edges of the conductive component and the first layer may be disposed between the conductive component and the second layer. Also provided is a method of manufacturing of the electrically insulated component.

Provided are a metal foil, a metal foil manufacturing method and a method for manufacturing an electrode using the same, in which the adhesion between the metal foil and a conductive resin layer and the coating performance of the conductive resin layer can be improved by treating the surface of the metal foil. The metal foil comprises: a metal base substrate; a surface treatment layer formed on at least one surface of the metal base substrate by treating the surface of the metal base substrate; and a conductive resin layer applied to the surface of the surface treatment layer, wherein the surface treatment layer has a surface energy of 34-46 dyne/cm.

A method is provided for forming a biphilic surface on a substrate comprising copper, such as a heat exchanger surface, wherein the method involves forming one or more hydrophilic areas on the surface by reacting those areas with at least one of hydrogen peroxide and ammonium hydroxide to form copper oxide and forming hydrophobic areas on the surface by reacting those areas with ammonium hydroxide solution to form copper hydroxide or by chemical etching with a combination of hydrochloric acid, hydrogen peroxide, and iron chloride. The functional surface can exhibit temporal biphilicity in response to one or more stimuli in high performance heat transfer applications.

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCB's. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCB's, in particular for PCB's having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.

There is provided is a black metal fastener member that can be manufactured at low cost. A fastener member comprises a base material made of a copper alloy containing zinc at a concentration of 30% by mass or more and 43% by mass or less, and a black copper oxide coating covering at least a part of the base material.

[Problem] An object is to provide novel composite copper foils. [Means to solve the problem] A composite copper foil comprises a copper foil and a layer of metal other than copper, the metal layer being formed on at least a part of a surface of the copper foil, wherein at least a part of the composite copper foil has protrusions on a surface thereof, and each protrusion has a height of 10 nm or more but 1000 nm or less in a cross-section of the composite copper foil.

An interconnected open-pore 2.5D Cu/CuO foam-based photothermal evaporator capable of achieving a high evaporation rate of 4.1 kg m.sup.-2 h.sup.-1 under one sun illumination by exposing one end of the planar structure to air is disclosed. The micro-sized open-pore structure of Cu/CuO foam allows it to trap incident sunlight, and the densely distributed blade-like CuO nanostructures effectively scatter sunlight inside pores simultaneously. The inherent hydrophilicity of CuO and capillarity forces from the porous structure of Cu foam continuously supply sufficient water. Moreover, the doubled working sides of Cu/CuO foam enlarge the exposure area enabling efficient vapor diffusion. The feasible fabrication process and the combined structural features of Cu/CuO foam offer new insight into the future development of solar-driven evaporators in large-scale applications with practical durability.

An interconnected open-pore 2.5D Cu/CuO foam-based photothermal evaporator capable of achieving a high evaporation rate of 4.1 kg m.sup.-2 h.sup.-1 under one sun illumination by exposing one end of the planar structure to air is disclosed. The micro-sized open-pore structure of Cu/CuO foam allows it to trap incident sunlight, and the densely distributed blade-like CuO nanostructures effectively scatter sunlight inside pores simultaneously. The inherent hydrophilicity of CuO and capillarity forces from the porous structure of Cu foam continuously supply sufficient water. Moreover, the doubled working sides of Cu/CuO foam enlarge the exposure area enabling efficient vapor diffusion. The feasible fabrication process and the combined structural features of Cu/CuO foam offer new insight into the future development of solar-driven evaporators in large-scale applications with practical durability.