An aluminized metallic scaffold for high temperature applications comprises a porous non-refractory alloy structure including a network of interconnected pores extending therethrough. The porous non-refractory alloy structure comprises a transition metal phase and an aluminide phase, and portions of the porous non-refractory alloy structure between interconnected pores have a thickness no greater than about 500 nm. A method of making an aluminized metallic scaffold for high-temperature applications comprises introducing aluminum into a surface of a porous metallic structure at an elevated temperature. The porous metallic structure comprises a transition metal and has a network of interconnected pores extending therethrough, where portions of the porous metallic structure between interconnected pores have a thickness no greater than about 500 nm. As the aluminum is introduced into the surface and diffusion occurs, an aluminide phase is formed, resulting in a porous non-refractory alloy structure comprising the aluminide phase and a transition metal phase.

An aluminized metallic scaffold for high temperature applications comprises a porous non-refractory alloy structure including a network of interconnected pores extending therethrough. The porous non-refractory alloy structure comprises a transition metal phase and an aluminide phase, and portions of the porous non-refractory alloy structure between interconnected pores have a thickness no greater than about 500 nm. A method of making an aluminized metallic scaffold for high-temperature applications comprises introducing aluminum into a surface of a porous metallic structure at an elevated temperature. The porous metallic structure comprises a transition metal and has a network of interconnected pores extending therethrough, where portions of the porous metallic structure between interconnected pores have a thickness no greater than about 500 nm. As the aluminum is introduced into the surface and diffusion occurs, an aluminide phase is formed, resulting in a porous non-refractory alloy structure comprising the aluminide phase and a transition metal phase.

A vapor chamber that includes a housing having a first sheet and a second sheet that oppose each other and that are joined to each other in a peripheral region of the housing; a working liquid enclosed within the housing; and a wick structure on an inside surface of the first sheet or the second sheet. In the vapor chamber, the wick structure includes multiple protruding portions and a grid portion integral with the protruding portions. In addition, surfaces of the protruding portions and a surface of the grid portion opposite the inside surface of the first sheet or the second sheet are positioned on a same flat surface.

A method of manufacturing a catheter tip by electroplating a conductive material over an insert comprising a negative to a domelike shape thereby forming a shape of the catheter tip comprising a dome with the domelike shape, selectively positioning a plurality of irrigation holes between outer and inner surfaces of the catheter tip, removing the insert thereby leaving the catheter tip and the plurality of irrigation holes, and electropolishing the catheter tip. In other examples, the insert is not removed and instead the step of electroplating causes the insert to be encapsulated with the conductive material thereby forming the catheter tip.

A porous body including a framework having a three-dimensional network structure, the framework having a body including nickel, cobalt, a first element and a second element as constituent elements, the cobalt having a proportion in mass of 0.2 or more and 0.8 or less relative to a total mass of the nickel and the cobalt, the first element including of at least one element selected from the group including of boron, iron and calcium, the second element including of at least one element selected from the group consisting of sodium, magnesium, aluminum, silicon, potassium, titanium, chromium, copper, zinc and tin, the first and second elements together having a proportion in mass of 5 ppm or more and 50,000 ppm or less in total relative to the body of the framework.

A porous body includes a framework having a three-dimensional network structure, the framework having a body including crystal grains including nickel and cobalt as constituent elements, the cobalt having a proportion in mass of 0.2 or more and 0.8 or less with respect to a total mass of the nickel and the cobalt, the crystal grains having a shorter grain diameter of 2 μm or more, as determined in a first observed image obtained by observing the body of the framework in cross section at a magnification of 200 times.

An electroforming method capable of suppressing peeling of an electroforming material from an electroforming master during electroforming, and controlling a shape of an electroforming material, and a method for producing an electroforming material are provided. The present invention is to provide the electroforming method including forming an electroforming material on a surface of an electroforming master in an electroforming liquid by using the electroforming master as a cathode, in which the electroforming master includes a conductive substrate having a pattern on a surface, the pattern having a protruding portion of which a surface is non-conductive, and an underlying layer that has a sheet resistance of 500Ω/□ or greater, and that is formed on at least a part of the surface of the substrate in an in-plane direction, and the method for producing an electroforming material.

An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.

A thin-walled metal part, and a method to fabricate such a part out of various alloys. A plurality of layers are formed, each of the layers being formed on a polymer template or on a previously formed layer. A homogenizing heat treatment is used to cause chemical elements in the layers to interdiffuse, to form a single continuous layer with a substantially uniform alloy composition.