C25D11/246

Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same

Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

ELECTRONIC DEVICE INCLUDING PLATE, PLATE, AND METHOD FOR MANUFACTURING PLATE

According to various embodiments of the present disclosure, an electronic device may comprise a housing including a front plate and a rear plate and a display. At least one of the front plate or the rear plate may include a plate exposed to an outside. The plate may include a metal member including a first metal and an oxide layer formed on at least one surface of the metal member. The metal member may comprise a first portion including irregularities formed by at least one second metal included in a first solution, the at least one second metal being substituted for the a portion of the metal member, the at least one second metal being removed from the metal member by the first solution and a flat second portion etched by the first solution.

Assemblies and methods for anodizing a workpiece selectively using a combination of a mechanical mask and a gas bubble or air pocket mask
11535948 · 2022-12-27 ·

Metal components that require anodic coating or anodizing, may also require some surfaces of the component to be free of the anodic coating for the purpose of conductivity. The presence of the anodic coating on surfaces of the component that require conductivity would make those surface more electrically resistant or nonconductive. A combination of a gas pocket or air bubble to create a barrier to anodizing in a cavities of a workpiece (or in a cavity created by a conformal compression material) and the use of a (e.g., compressible) mask/seal material to mask off other surfaces though a gasket sealing function, is used. The mask/seal material may be compressed and makes a seal of some surfaces using pressure from clamping or pressure mechanisms. At least two opposing surfaces are masked by the compressive mask/seal material on one end and a gas pocket on the other end. The gas pocket will allow the anode to make firm electrical contact with the workpiece. The unmasked surfaces of the workpiece will be contacted by the electrolyte and consequently anodized. These anodized surfaces will have more electrical resistance (e.g., have higher resistance, and might even be non-conductive) than the masked surfaces that were not anodized. Further, the selectively anodized surfaces can be colored, seal, or have other conventional post anodizing processes applied.

CONFORMAL YTTRIUM OXIDE COATING

Exemplary methods of coating a semiconductor component substrate may include submerging the semiconductor component substrate in an alkaline electrolyte. The alkaline electrolyte may include yttrium. The methods may include igniting a plasma at a surface of the semiconductor component substrate for a period of time less than or about 12 hours. The methods may include forming a yttrium-containing oxide on the semiconductor component substrate. A surface of the yttrium-containing oxide may be characterized by a yttrium incorporation of greater than or about 10 at. %.

ELECTRONIC DEVICE HAVING HOUSING HAVING MATT SURFACE AND METHOD OF PRODUCING THE SAME
20220400569 · 2022-12-15 ·

Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.

Ceramic-containing and ceramic composite transaction cards
11521035 · 2022-12-06 · ·

A process for making a card includes the steps of forming a core layer having a first surface and a second surface, disposing an uncured decorative ceramic layer of ceramic particles disposed in a resin binder over the first surface of the core layer, such as by spray coating, and curing the uncured decorative ceramic layer to form a cured decorative ceramic layer. Card products of the process may have a core layer of metal, ceramic, or a combination thereof that form a bulk of the card.

METHOD FOR CHEMICAL POLISH FOR METAL PIECES
20220372633 · 2022-11-24 · ·

A method for chemically polishing a metal surface within a metal-polymer composite, where the composite includes at least one metal part and at least one part made of a polymer composition, the method including the step of: (i) contacting the surface of at least one metal part at least partially with an aqueous solution including an oxidizing agent and an alkaline agent, at a temperature and for a duration sufficient to obtain a shiny metal surface. Also a metal-polymer composite that includes at least one part made of a polymer composition and at least one chemically polished metal part and that is obtainable by the method and to a product including the metal-polymer composite.

DRYING DEVICE, PRINTING DEVICE AND PRINTING METHOD
20220371336 · 2022-11-24 ·

A drying device includes a heating member for conveying and heating a heating subject in a contact manner on which a liquid composition has been applied, the heating member including a substrate, a surface layer disposed on the substrate, the surface layer including a supporting layer including sulfuric acid anodized aluminum film having concave portions and non-concave portions, and a fluororesin at least partially attached to the concave portions, and a heating device for heating the heating subject via the surface layer, and a temperature measuring member for measuring the temperature of a temperature measuring point in a region of the heating member that has contacted the heating subject in a non-contact manner.

METHOD FOR SEALING ALUMINUM ALLOYS

A method for the surface treatment of an aluminum or aluminum alloy part configured for use in the aviation sector, includes the steps of: i) subjecting said part to an anodization step; ii) treating the anodized part with a post-anodization sealing method according to the invention; and optionally iii) applying one or more layer(s) of paint; or optionally iv) applying a hard anodic oxidation treatment to at least some of the functional areas of the part. A part made of aluminum or aluminum alloy is treated with a post-anodization sealing method, optionally includes one or more layer(s) of paints or optionally having, on certain functional areas, a hard anodic oxidation treatment, wherein the part is configured for use in the aviation sector.

METHOD TO APPLY COLOR COATINGS ON ALLOYS
20220364253 · 2022-11-17 ·

In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.